Electronics Forum | Fri May 22 12:42:43 EDT 2015 | deanm
Sr. Tech, you are right in that there is no verification of the profile. We are a Class 3 high mix OEM. We have visual inspection after SMT. We have not seen problems with wetting, grainy solder, cold solder, charred boards, etc. that would indicate
Electronics Forum | Thu Jul 20 16:08:18 EDT 2000 | Grant Baynham
Do you have any experience with flip chip applications using lead-free solder, and specifically do you have any information revealing how the process parameters for standard air reflow atmosphere can be modified to match the results for solder reflow
Electronics Forum | Mon May 21 17:32:23 EDT 2001 | davef
I said: "Our electronic circuit board fabricators seal the boards in moisture barrier bags [MBB]. We discontinued the use of desiccant bags in these MBB because of concerns about the desiccant releasing materials that would affect the solderability
Electronics Forum | Thu Jul 11 17:26:27 EDT 2002 | Tony B
Does anyone know how the Fuji IP2 can be adapted to place BGA's? The MTU places the chip on a carrier with suction in the center and it will not hold on to the BGA due to the lack of a flat surface on the bottom. I have had limited success building
Electronics Forum | Thu Jul 11 20:36:43 EDT 2002 | cyber_wolf
It will place BGA's, but you will be centering by using the part outline. The IP2 cannot be adapted to do individual ball inspection.(You may already know this) As far as getting the part to stay on the part shuttle, I am sure that there is somethin
Electronics Forum | Fri Jul 12 12:30:56 EDT 2002 | soupatech
I just go off the phone w/ Fuji and they seem to think that the lizard tounge (used another name, same idea) is only available for the IP3. They had a few other suggestions for adapting the IP2 like a rubber pad for the carrier or building "rails" to
Electronics Forum | Fri Feb 13 11:46:23 EST 2004 | Jack
Is your customer trying to reduce voiding? If the device is using Sn90 / Pb10 and the paste is Sn63/Pb37 the board will melt first. However, if both solders are 183C eutectic, it's a tossup? PCB design, copper weight, bga type (pbga, micro bga, Tbg
Electronics Forum | Thu Jun 03 01:57:25 EDT 2004 | Frank
I receive no benifit from this, but I have been using Juki pick'n'place for over 7 years. Juki machines are easy to learn and have been very reliable for us. Their service and support have been top-notch all the way (at least here in the US). Thei
Electronics Forum | Fri Jun 04 20:08:13 EDT 2004 | Ken
Rick P. is the Assembleon local Field Service Engineer. He is very good. He is stationed in the Portland Metro area. Oregon and Washington have a very dense population of Philips (assembleon) machines. Extensive installation base. I recently in
Electronics Forum | Wed Jul 07 14:32:24 EDT 2004 | Tom B
We have done the same using a Red Mask instead of Green. Its definitely a good idea. It makes it easier to distinguish lead-free from lead assemblies. However, unless you are totally lead-free or two processes are isolated, it will happen that you
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