Electronics Forum | Mon Aug 02 09:26:15 EDT 2004 | davef
Q1: How do you define torque setting for screw? A1: Talk to people at your nut supplier. Some nut suppliers post torque tables on the web. For instance: http://www.thelenchannel.com/1torque.html http://www.marfas.com/Ttorque.shtml http://www.pac
Electronics Forum | Mon Aug 16 20:19:10 EDT 2004 | Grant
Hi, We have both Vapor Phase ASSCON semi auto as well as Soltec convection inline ovens. I must say we had no end of problems with Vapor Phase. We tried everything, and just could not totally eliminate tomb-stoning completely. We would always get a
Electronics Forum | Mon Dec 11 20:44:37 EST 2006 | davef
Title : LEAD-FREE WAVE SOLDER FLUX EVALUATION Author : Michael Havener Author Company : Benchmark Electronics, Inc Date : 09/25/2005 Conference : SMTA International Abstract : The European Union�s deadline to ban lead in electronic pr
Electronics Forum | Fri Nov 05 10:35:18 EDT 2010 | methos1979
This was a great post from another thread here with some tips: Date: November 04, 2010 07:42 PM Author: eadthem Subject: Who has best desktop AOI ? We do almost exclusively SMT parts but for solder with a 45 degree fillet angle use vertical light
Electronics Forum | Sun Dec 10 11:55:16 EST 2000 | Bob Willis
The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)
Electronics Forum | Sun Dec 10 11:55:28 EST 2000 | Bob Willis
The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)
Electronics Forum | Sun Dec 10 11:56:05 EST 2000 | Bob Willis
The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)
Electronics Forum | Wed Jul 21 11:49:24 EDT 1999 | Deon Nungaray
| | | | I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk
Electronics Forum | Fri Jun 24 08:47:14 EDT 2005 | grantp
Hi, There are many aspects to consider. 1. Firstly the room needs to be designed so it's sealed, so linoleum floors than curve where the wall meets the floor, so dirt does not get trapped in the corners, and mops get all dirt and pick it up. Floor
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
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