Electronics Forum | Mon Sep 27 18:06:26 EDT 1999 | Scott Cook
| Does anyone have any figures on what % extra compnents should be supplied on chip components for a particular product build. Typicaly there is wastage due to dropout in loading, 1st board build and machine rejections. Is there any industry standard
Electronics Forum | Tue Sep 21 08:43:28 EDT 1999 | Christopher Cross
We are finding solder shorts under 1206 Components on the bottom side of our boards.In all cases these shorts are from either side of the component to a feed-thru under the component body. Adhesive is used to glue down the component and then the boar
Electronics Forum | Tue Sep 21 09:33:30 EDT 1999 | Scott Davies
| | | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | | | thanks | | | | | We use 6 mil lasercut stencils w
Electronics Forum | Mon Sep 20 14:53:24 EDT 1999 | Doug
I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. The stencil is 6 mil thick, laser cut and electo-polished. The apertures are 12 mil in diameter with 20 mil pitch. We are using Alpha
Electronics Forum | Fri Sep 17 11:16:58 EDT 1999 | Rob Moats
HI everyone, We are using a Siemens ap-25 screen printer, in the past we have not had any problems with adhesive placement until a couple of weeks ago. It seems the x axis has decided that it should be set somewhere between .00085 and .00150. No
Electronics Forum | Fri Sep 17 03:55:45 EDT 1999 | Brian
| We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a reco
Electronics Forum | Wed Sep 15 11:49:58 EDT 1999 | Scott S. Snider
| Looking for a manual machine to de-panel with the panels held by 60mm tabs. Each panel hold multi-boards consisting of different shapes and sizes. Scoring is apparently not an option and volume does not dictate a large scale machine. | Try CAB T
Electronics Forum | Sun Sep 12 18:47:48 EDT 1999 | armin tan
Our GSM1 keyboard is defective and upon inquiring the price from a local distributor here in Australia, I learned that it's more than $600 Aus Dollars including freight. It's pretty expensive for a PC/AT mini keyboard. Has anyone ever tried using an
Electronics Forum | Mon Sep 13 06:23:06 EDT 1999 | Earl Moon
| | We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems wi
Electronics Forum | Wed Sep 08 17:28:11 EDT 1999 | Earl Moon
| | Has anybody have any experience with Top placement of BGA's. GLue descretes on bottom and then wavesolder.? | | | | | | | Hi Chris, | Why don't you process a double side reflow and use selective wave fixture for wave process. The process w
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