Electronics Forum: used (Page 1331 of 2487)

Double Sided Reflow

Electronics Forum | Thu Mar 17 11:07:08 EST 2005 | Dougs

I'd agree with Justin, we do double sided reflow on most of our boards with fine pitch QFP's both sides, you do have a problem somewhere else, what size is you board? Is it warping slightly? What kind of oven are you using? Is it convection? fans

Double Sided Reflow

Electronics Forum | Tue Mar 22 12:04:31 EST 2005 | John S

Thanks for the advice. In this scenario we are designing our own product. Currently we are building at a prototype level with no appreciable wait between reflow passes. The part in question is a 64 pin QFP. We use a BTU VIP 98 with edge conveyor.

Reel Scan brand with Juki 2000 series machines

Electronics Forum | Thu Mar 17 15:03:23 EST 2005 | debh

Has anyone ever tried to use "Reel Scan" (brand) barcoding with Juki machines. We currently have 730-2020 and 2050-2060 lines set up. Was wondering how the compatibility is. (I think I already know the 730 is out...) I'll be asking the vendor also, b

Coplanarity check

Electronics Forum | Fri Mar 18 03:53:16 EST 2005 | devilhitam

hi guys, I need a help here. Does anyone know what is the standard for coplanarity check for fine pitch IC that well practiced? I am using SIEMENS F5 for fine pitch IC placement.SIEMENS F5 do have the capability for coplanarity check. My customer re

Stencil sink stink

Electronics Forum | Mon Mar 21 08:19:54 EST 2005 | Bob

Sounds like a flaw in your trap. It seams that during the pumping process the trap is ineffective or open, allowing normal sewer gases to bypass the trap and stink up your SMT area. This is similar to what happens when you do not use a drain for a lo

Not getting an E mail notification

Electronics Forum | Wed Mar 30 11:06:58 EST 2005 | masters

Yes, we are out there ;-) I have been looking into this amongst other existing site issues. Thank you for bringing this to our attention. The forum Site Support should automatically mail the staff to, which will be coming soon. Use 'Contact Us' for

Solder joint strength

Electronics Forum | Tue Mar 29 09:54:20 EST 2005 | chon

Indy, Please refer to IPC-TM-650 TEST METHOD MANUAL Number 2.4.21.1, this is the closest written procedure I've found and used for this. I hope helps or if someone has any other input please advise. On more thing I have this file just let me know if

Stencil Organization/Storage

Electronics Forum | Wed Mar 23 18:37:30 EST 2005 | KEN

We currently have about 800 active stencils. You Need a phase out program for your customers products. Otherwise you end up in stencil hell! Additionally, our smt team uses an access database to find what they need. Customer, assembly,revision, s

Granite Surface and ESD

Electronics Forum | Mon Mar 28 09:56:36 EST 2005 | n wolford

We have a granite table out on our production floor. We use the table along with metal parallel bars and a height gauge to measure component height. Some of these boards have components on them that may be ESD sensitive. Does anyone have experience w

Non-wetting: PTH on double-side reflow

Electronics Forum | Wed Apr 06 21:37:35 EDT 2005 | KEN

Are you saying you have solder balls (as in solder paste balls) at the lead tips (or land tip)? This means your thermal profile is not hot enough. why the sudden cahnge? I will bet the lead frame material was copper and is now alloy 42. sounds like


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