Electronics Forum | Tue Jan 02 09:54:56 EST 2007 | slthomas
Chalk this one up to semantics. Regardless of when you start pumping (do you use a needle with a foot? In that case the pump will run when the foot touches the board), your volume of epoxy is the same. You just have less room for it where there is si
Electronics Forum | Thu Jan 18 09:54:22 EST 2007 | SWAG
Thanks for your advice, all. We do not use tooling, Pavel. We requested a board thickness change from our customer - it turns out that the unusual thickness was designed for mechanical fit-up only and this thickness is no longer a concern as the as
Electronics Forum | Wed Feb 21 21:01:57 EST 2007 | davef
Yes. Heat reduces OSP solderability protection thickness. For instance, many OSP are shot at the end of the first reflow pass and the exposed copper is free to oxidize. If you're speedy, you can pull-off the second reflow cycle before the copper g
Electronics Forum | Wed Jan 03 23:00:18 EST 2007 | new guy
I'm a new guy in this field. I have a question about solder paste process. Is there any effect to the solderbility if we do a lot of contact to copper pad without using any insulation ( direct to the finger ). Where can i get information about smt pr
Electronics Forum | Fri Jan 05 20:12:22 EST 2007 | engr
I am using PWB material Rogers 6002 High Frequency Laminate. The PWBs are assembled. They were washed and will require a bake out. Some people say, no bake out is required for the material. I am getting different reads in test if the CCAs are not
Electronics Forum | Thu Jan 11 22:15:27 EST 2007 | behrsam
it's a vacuum dewar so adhesives will eventually permeate and the vacuum would be lost. Sounds to me since I have the N2 capability, I definately should try it. I am obtaining Indium Flux and Solvent so I can adjust the activity when I start using
Electronics Forum | Thu Jan 11 16:01:52 EST 2007 | russ
You using lead free BGAS now? What is your rework equipment and process? I am sure we can help you out here with some more detail, you should get the package data sheets for your problem BGAs and determine ball alloy or they may even be CCGA packag
Electronics Forum | Sun Jan 14 12:48:53 EST 2007 | SMTRework
Also, I was beginning to think that the humidity level in the facility was a factor.. but I don't believe that's the case.. as this condition seems to occur regardless of the humidity level.. Equipment being used is as follows.. Metcal BGA 3500
Electronics Forum | Mon Jan 15 13:31:11 EST 2007 | John S.
Since it is in a pallet, I would be sure the preheat temperature is correct across the entire assembly. We've seen large temperatue delta's across assemblies that are soldered in pallets. Could be overheated even or contact time too long. Interest
Electronics Forum | Wed Jan 24 10:20:39 EST 2007 | electronhose
Seriously, OSP?, change the board finish, you are the OEM, correct? You have the power! Also, as another poster mentioned, high force applied at ICT ( possibily to cut through the OSP goop ?!? ) could be warping the board enough to crack the joints.
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