Electronics Forum | Tue Nov 16 09:44:18 EST 1999 | - bobar
Ken, The technology you are referring to is also known as return-to-web. This panelization method involves a hard tooled perimeter die and a press equipped with an air cushion. The PCB circuit is punched out and then inserted or "pushed" back into
Electronics Forum | Mon Oct 11 12:24:07 EDT 1999 | John Thorup
| | Folk's, | | | | I'm just tying up some loose end's on my Master's Thesis on solderballing @ wave soldering and the effect the topography of the mask / PCB has on it. | | I was wanting to do a straw poll on you guy's as to the type of resist's yo
Electronics Forum | Thu Oct 07 16:57:02 EDT 1999 | Glenn Robertson
| | I have a board, 4 spacers needed to be soldered on the board | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first, there wi
Electronics Forum | Wed Oct 06 15:29:24 EDT 1999 | Tony
| Our first article inspection after machine placement can take several hours depending on the complexity of the board. The operator visually checks the board against the drawing and bill of material. I'd be interested to hear if there are any other
Electronics Forum | Thu Oct 07 03:19:33 EDT 1999 | Chris May
| Our first article inspection after machine placement can take several hours depending on the complexity of the board. The operator visually checks the board against the drawing and bill of material. I'd be interested to hear if there are any other
Electronics Forum | Thu Oct 07 13:47:19 EDT 1999 | Doug Philbrick
| Our first article inspection after machine placement can take several hours depending on the complexity of the board. The operator visually checks the board against the drawing and bill of material. I'd be interested to hear if there are any other
Electronics Forum | Wed Oct 06 00:26:04 EDT 1999 | Karlin
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Wed Oct 06 08:41:42 EDT 1999 | Dave F
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Mon Sep 27 09:13:46 EDT 1999 | John O'Brien
| Writing the final report for my engineering studies (microsystem technology) I'm treating the identification of PCBs from automotive applications by laser marking with a data matrix code. | | | No I'm trying to set up a programme of how to test t
Electronics Forum | Sat Sep 25 09:18:40 EDT 1999 | Steve E ( Fuji America )
| Question for you SMT guru's out there. | | What is the best way to support boards on Fuji's CP6 machine's x-y table...particularly for 2nd side SMT where the support side already has parts... I am toying around with the following methods: | | 1.
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