Electronics Forum | Wed Jun 26 15:34:09 EDT 2002 | Daan Terstegge
It does work, but you must keep in mind that not only the stencil must be designed for it, but also the board. Trying to use the pin-in-paste process for a connector with an ordinary wave-solder layout will result in lots of touch-up. You'll need sma
Electronics Forum | Mon Jun 24 19:15:13 EDT 2002 | Chris C
Do I really need a Vapour Phase Oven or a Nitrogen Oven when soldering PBGA's if my PCB has only 2 to 3 BGA's (ball pitch of 0.5mm to 1.27mm) ? Is the quality of soldering when using an 8-Zone Convective Oven is not acceptable? I have been bombarded
Electronics Forum | Tue Jun 25 13:30:42 EDT 2002 | Jeff Park
Folks, I am interested in learning more about solder robbing pads to help and avoid bridging for wave solder applications. I have heard of a few companys that use this process in their design but have not seen any documents for design rules etc.
Electronics Forum | Wed Jun 26 10:36:24 EDT 2002 | Steve L
Thanks for all of your valuable inputs. The paste we are useing is PWS0111Ae36 (Alpha MEtal), peak temp from 210 to 225 C. The paste was on the floor about 3 weeks. ianchan, when you mentioned "no more than 6 hrs in the stencil", you mean no more t
Electronics Forum | Fri Jun 28 03:04:21 EDT 2002 | Dreamsniper
Forgot to include the following: Dwell time is from 55 secs to 68 secs. Indium specs for the paste is maximum peak @ 228'C and 30 to 90 secs dwell time above 183'C. PCB is a 6 layer board with Dimension of 205 x 166 mm but is slightly dense with 11
Electronics Forum | Tue Oct 01 08:01:23 EDT 2002 | mjz289
WE USE A HELLER 1500 EXL OVEN (5 ZONE OVEN) AND HAVE BEEN DOING PBGAs FROM 292 TO 780 BALLS WITH .O32" PITCH (.8 mm) AND METAL STIFFENERS ON TOP WITH NO PROBLEMS. I AM GETTING 210 - 215 DEGREES C AT THE BGA BALLS WITH 50 - 65 SECONDS ABOVE LIQUIDUS
Electronics Forum | Tue Jul 02 21:47:44 EDT 2002 | alex_kirichenko
Hello everybody!!! We are going to start loading 0402s and I'm looking into all diffirent sorts of problems. From this forum I see that tombstoning is the main one. I found article about using U-shape appeture design for 0402s. I never had stenc
Electronics Forum | Fri Jul 05 23:51:34 EDT 2002 | fastek
Sold a customer a Conceptronics HVA-70 Convection Reflow Oven recently. While performing the install I asked if compressed air was hooked up. Seems this customer ...who already had a HVA-70 convection reflow oven never used air or nitrogen with that
Electronics Forum | Mon Jul 08 09:52:37 EDT 2002 | gdstanton
Folks, Looking for some feedback from anyone who has had experience with panelized or palletized CCAs, or anyone interesting on commenting, where interconnects were used to facilited a "gang" incircuit and functional test. We are considering implem
Electronics Forum | Sat Jul 13 09:00:44 EDT 2002 | davef
One of those pick your poison things, eh? * Reduce tester time and labor versus not testing the board after seperation from the panel * Traces that connected to the common bus will have exposed copper after seperation from the panel. This is not rec
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