Electronics Forum: used (Page 1781 of 2487)

Circuit Cam Capability

Electronics Forum | Wed Nov 15 10:40:52 EST 2006 | pms

To bad Steve, CircuitCam is good stuff. On a side note. Large programs on MyData's. We load the machine with all the mags it will handle. Run the program, take out mags that the program has used, insert other mags with the incompleted parts, run pro

Circuit Cam Capability

Electronics Forum | Thu Nov 16 09:45:51 EST 2006 | rgduval

I'm only peripherally aware of CircuitCam; we were adopting it in a past-life, and I wasn't terribly connected with the adoption. However, I thought that it did have the capability of optimizing a job to a production line (assuming the two machines

Wave Solder - solder bubbles/outgassing??

Electronics Forum | Fri Nov 17 17:34:26 EST 2006 | realchunks

OK, why are you hand fluxing? You may want to take the time to use your real fluxer. Yeah, it's a bit messy but you can control the amount of flux you're putting on the board. And with water based fluxes, this is critical. If you are stuck to han

hot air rework station / solder paste

Electronics Forum | Fri Nov 17 15:12:26 EST 2006 | mds33200

Hi, I am located in Auburn Mass (USA) right near Worcester. Now I noticed you talked about micro stencil for a populated PCB, would I need one? Or could I use a syringe to lay a tiny dot of paste since im only replacing a chip or 2 (at the moment)? I

DPAK pad layout

Electronics Forum | Fri Nov 17 15:04:59 EST 2006 | ehess

WE have a problem with a DPAK component floating during reflow, causing it to move to the point where it affects the toe fillet. We have been using a dot of SMT epoxy to hold it secure for the moment. I have looked on many sites, but no whrere can

Too much solder paste cause tombstoning?

Electronics Forum | Tue Nov 28 11:12:48 EST 2006 | billwestiet

The ONLY (unlikely) cause I could think of is if you are pushing the component into the solder, ending up with more solder on one side than the other. Why do you think it is the volume of solder that is causing this? By the way, there are "low tomb

AOI: Agilent vs. Omron vs. MIRTec/YESTech?

Electronics Forum | Mon Nov 27 09:17:54 EST 2006 | lrd116

Could anyone please help me in my evaluation of Agilent vs. Omron vs. MIRTech/YESTech AOI? We are a high-mix low-to-mid volume manufacturer looking to gain not just a screening method but real process understanding that a Quality Engineer (myself) w

AOI: Agilent vs. Omron vs. MIRTec/YESTech?

Electronics Forum | Tue Nov 28 05:31:04 EST 2006 | egrice

Lou, You should look at the ERSA/Modus AOI System! The Modus AOI uses a high resolution industrial scanner rather than a camera mounted to a gantry. It's way faster (12 seconds for whole board ) and can do everything that a camera can do and more

"Gap" in completed solder joint between lead and pad

Electronics Forum | Thu Nov 30 15:19:56 EST 2006 | CK the Flip

Mike, dude, I feel your pain. Hearing stories like this makes my blood boil! It's almost as ridiculous as a customer who told me to put more solder paste on a MELF component to overcome noise issues - he used more solder paste as antennas to overco

Flux residue cause high false reject at ICT

Electronics Forum | Wed Nov 29 01:25:53 EST 2006 | callckq

Dear All, I have 1 product that using solder bar from vendor called Asahi. After wave process, we found quite a sticky flux residue remain on the board. Eventually, have huge impact on our ICT fisrt pass yield(FPY). Current FPY is a the range of


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