Electronics Forum | Sat Dec 13 08:03:46 EST 2003 | Stefan Witte
The only part, which could cause component misplacement on the rotary heads of the Siplace machine is the vacuum valve. I don�t know the official name in the part catalog, but I use to name it plunger. The plunger is moved in and out by a miniature s
Electronics Forum | Thu Jan 08 15:03:40 EST 2004 | dwzeek
We have an ongoing problem with our QFP144 packages soldering. It has not received much attention until late due to some customer failures. Most of the failures would show up in ESS testing and be repaired. The failure rate is about 2 in 1000 parts f
Electronics Forum | Wed Jan 28 19:32:26 EST 2004 | Bobby
Joe, You would be best off going with a larger company such as Universal or Mydata at this point. The market is still bad and this is where you will get your best deals. They offer better support than a small company. Small companies like Contact sys
Electronics Forum | Thu Apr 01 13:16:56 EST 2004 | Jimmy
>When these boards are built new do we not have solder >>paste on the ground pad and then reflow? Has this caused >>any misregistration for you? We didnt assemble these boards so I have no knowledge of the manufacturing process that was implemented h
Electronics Forum | Fri Apr 09 01:41:35 EDT 2004 | Mike Konrad
Although water soluble (OA) flux is technically the easiest flux to remove, it is also the most damaging type of flux if not removed. A dishwasher lacks the pressure and nozzle design to produce the very small water particle size required for thorou
Electronics Forum | Tue Apr 13 13:45:26 EDT 2004 | arcandspark
Ken you say reaching 218 to 221 C will give a homogenus solder ball. The pb free solder balls on the BGA reflow at 235 C to 238 C but I have seen when you combin to differnt types of solder say 63-37 and 10-90 you will atually lower the melting point
Electronics Forum | Tue Apr 13 09:46:39 EDT 2004 | davef
Now, that's different. We misunderstood the problem from your original descrtiption. We thought the voids were showing at the via in the pad. Now, we understand the voids appear to be in the solder balls. Suggestions are: * Search the SMTnet Arch
Electronics Forum | Tue Apr 13 19:14:25 EDT 2004 | Dreamsniper
Hi DaveF, To explain. The BGA that we have is from Motorola. The solder balls of these BGA's are Eutectic Solder and processed using a NC flux (as per info from supplier). So this means that the BGA pad and solder connections had NC flux process. W
Electronics Forum | Fri Apr 16 11:03:35 EDT 2004 | davef
Your copper corrosion is not good. It indicates that you have not done a good job in cleaning. [We assume this is a medium green color, not unlike the color of the solder mask on your board, that is almost like a translucent lacquer; rather than th
Electronics Forum | Mon May 10 09:30:35 EDT 2004 | davef
Q1: What are the basic requirements of thermal profiling? A1: Not sure what you�re looking for here, but when doing a profile, you�re trying to measure the temperature at specific points of the board, as the board moves through the oven. Q2: How we
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