Electronics Forum: used (Page 2041 of 2487)

Warp PCBA- how to repair ** Question #2

Electronics Forum | Mon Jul 16 21:44:07 EDT 2001 | davef

You�re correct. If you attach $5 to each board, your customer will be happy to approve your process change. Consider: �Process Improvement Strategies: Implementation Of A No-Clean Process" http://www.smta.org/knowledge/proceedings_abstract.cfm?PRO

Sponge Control

Electronics Forum | Fri Jul 20 18:07:16 EDT 2001 | mparker

The latent contamination in sponges seems to be a minimal concern to me. Sponges will harbor more bacteria than a wet rag that is washable, but that is of greater concern in the kitchen than the rework line. Keeping a properly tinned solder tip is m

Scored Printed Circuit Boards

Electronics Forum | Fri Aug 10 07:54:20 EDT 2001 | John

We use scored boards almost exclusively on our new products, but there are some things to be aware of. 1) If it has SMT on it, hand breaking it is a bad idea (our customers refuse to discuss it). 2) Pizza cutters are a bad idea (our customers shou

Grid Lok

Electronics Forum | Tue Jul 31 15:29:45 EDT 2001 | hinerman

Research was done into the deflection of a totally unsupported (topside) PCB of 0.050" thickness. A dial indicator was placed on the surface and the tooling was set. The deflection ranged from 0.005" to 0.007". This is minor when you consider th

Unsoldered Component

Electronics Forum | Fri Aug 03 15:58:07 EDT 2001 | arsmoriendi

Hi again! First thanks to all for your help. Second, i beleive that i need to clarify something, the unsoldered component was caused due a missing window in the stencil, the process engineer leave the stencil in the production line after i

Moisture sensitive Devices

Electronics Forum | Tue Feb 08 12:39:52 EST 2000 | Ashok Dhawan

I have three questions on moisture sensitive devices: 1. What is general practice on incoming / receiving inspection of moisture sensitive devices- which boils down to mostly FPDs and BGAs ? Traditionally, FPD packs were opened only at time of use

Re: Reflow glue and past.

Electronics Forum | Wed Feb 09 21:29:28 EST 2000 | Dave F

Charlie: People cure glue using their paste reflow profile all the time. And most of them are happy. Personally, I�m with Dean and Travis. It�s possible to as you suggest, it�s appealing not to mess with your oven profile, but it just doesn�t s

Re: Defects Definition

Electronics Forum | Mon Feb 07 19:49:50 EST 2000 | Tony Di Mauro

Jose, I have seen this defect before. We called it re-reflow. We found the part was originally attached at SMT. Later on after seeing a heat cycle at the wave machine the leads would de-attach causing an open at In-Circuit Test. Resolution was t

Re: BGA Rework options

Electronics Forum | Thu Feb 03 20:45:28 EST 2000 | Gary

I have worked with the PDR type rework station on and off for 12 years and have found that the IR can offer a lot of advantages over hot air. As was mentioned the lack of nozzels is a great advantage. The back heater takes a while to warm up but on

Re: fid recognition on a universal 4785

Electronics Forum | Tue Feb 01 19:22:11 EST 2000 | Jason Bentley

What kind of errors are you getting. make sure that you have the right size fid's and the color is correct in the program. This is the main problem that I run into and it usually corrects the problem. Make sure that it is looking in the right X and Y


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