Electronics Forum: used (Page 2051 of 2487)

Re: Heat Dissipation Problem

Electronics Forum | Thu Sep 02 04:26:02 EDT 1999 | Wolfgang Busko

| | To aid in heat dissipation of our PCB, we would like to try having copper fill areas on the board that are hot air levelled and not covered with solder resist. Then, when the board is reflowed, solder paste would be applied and then solder. Has a

Re: Solder Joint Integrity

Electronics Forum | Wed Sep 01 13:48:29 EDT 1999 | Dave F

| Dear fellow process engineers, | | Some solder joints "trough hole component" have cracked. I suspect that in the market some technician tryed to straighten some components (LED) and has applied enough force to actually brake the joint. The joints

Substitute parts

Electronics Forum | Tue Aug 31 13:54:50 EDT 1999 | David Spilker

Do any SMTneters out there have a good solution to substitute SMT parts that you are willing to share? I presume all of us have the issue where purchasing wants to buy "the same part" from a different vendor. While the part may be the same electrical

SMT and TH board carrier

Electronics Forum | Fri Aug 27 10:25:52 EDT 1999 | Matthew Park

Is it feasible to have one type of board carriers to take boards thru 1) glue curing process for first side and 2)invert carriers with boards, and 3)reflowing second side, and 4) do manual stuffing of th components and 5) take them thru selective wav

Re: Mounting heights

Electronics Forum | Thu Aug 26 11:01:47 EDT 1999 | Wolfgang Busko

| For space contracts we have to mount chip capacitors/ resistors etc 0.1 to 0.4 mm from the pad height. | | This is to compenstae for the CTE differential in the substrate/component and also to ensure cleanliness. | | Does anyone have any new idea

Re: Mounting heights

Electronics Forum | Wed Sep 01 14:07:41 EDT 1999 | Dave F

| For space contracts we have to mount chip capacitors/ resistors etc 0.1 to 0.4 mm from the pad height. | | This is to compenstae for the CTE differential in the substrate/component and also to ensure cleanliness. | | Does anyone have any new idea

Re: Electrum bar solder

Electronics Forum | Thu Aug 26 08:15:13 EDT 1999 | Brian

| | Has anyone used bar solder from a company called "Electrum Inc." | | What kind of results did you have? | | | | | Hammer: Try: | | Electrum Recovery Works 827 Martin St Rahway, NJ 07065 908-396-1616 800-622-1192 Canada 800-535-1192 Fax: 908-3

Re: No-clean stencil apertures

Electronics Forum | Wed Aug 25 19:44:35 EDT 1999 | Dave F

| Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Cons

Re: Cylindrical diodes Missing during SMT process.

Electronics Forum | Thu Aug 26 04:22:26 EDT 1999 | JAX

| | | | | | | Hello everyone, | | | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Than

Re: Tooling pins

Electronics Forum | Tue Aug 24 15:06:06 EDT 1999 | John Thorup

| | I am looking for a source of tooling pins (various diameters) which can be easily attached (ie. taped) to pieces of FR-4 stock to allow for quick and cheap fixtures to run in my smt machines. I've seen these in the past where the pins are attach


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