Electronics Forum | Wed Nov 06 12:56:10 EST 2002 | slthomas
What I'm seeing is an occasional pattern of tear drop shaped features in a sea of nice shiny solder. The little islands don't really have any relief.....it's more of a surface finish feature than a 3-dimensional feature. The wetting angles are good,
Electronics Forum | Fri Nov 08 05:08:28 EST 2002 | zolasteven
Can anyone advise on the following : 1. Insufficient pcboard support during printing We are printing on double sided pc boards (approx. 8 ins by 6 ins). There is a problem of high paste when we are printing the second side. The reason bsing the boa
Electronics Forum | Fri Nov 08 11:37:44 EST 2002 | jonfox
1. Back in the early days of consumer digital cell phones, we ran into the same problem. PCB with 2000 parts in a 5"x2" area, and double sided. We ended up using our standard vacuum tooling for the NIC side and stiff ESD safe foam for the NAC side
Electronics Forum | Sun Nov 10 08:23:02 EST 2002 | davef
Organized or not, it is very easy to end-up with a bag of "fly shit" after sweeping the floor. Making measurements: * Search the net on "capacitance meter" to find an equipment supplier. HP [Aligent?] and IEC make very good meters. [We just use a F
Electronics Forum | Thu Nov 14 09:43:33 EST 2002 | MA/NY DDave
Hi I will only hit only a few and then bug out. Worked with one large EMS place that has the "fail first" approach to engineering and manufacturing. ( I know I know THEY all do). They didn't store the paste as the mfg suggested, they didn't control
Electronics Forum | Fri Nov 15 15:02:37 EST 2002 | MA/NY DDave
OK I know it is funny to have two different PWB/PCB processes, one for pre production and one post production yet it is possible if controlled and implemented in a strategy. In debug if your company's experience has been for a repeated need to do IC
Electronics Forum | Thu Nov 21 11:35:47 EST 2002 | hannahsd
We had several 4c's before we put them out to pasture. From my experience they are easy to make program adjustments, but like the previous person responded the auto programmer did not work for us. We had laser coplanarity check as an addition to th
Electronics Forum | Sat Apr 26 01:50:17 EDT 2003 | jojojameson
Dear All Our company as a group is known as NeST Group of companies.We started our activities in the feild of electronic manufacturing in the begining of 90's.Now we have operations in all range of activities in software development,hardware design &
Electronics Forum | Thu Nov 21 06:36:30 EST 2002 | Ben
I'm doing SMT of lead-free solder BGA on FR4 Ni-Au PCB. The solder paste I'm using is Sn/Ag/Cu and reflow with peak temp at 240C. I found there are voids(1-2) in almost every solder joint(500 micron in dia) under xray. And the void size is violate th
Electronics Forum | Mon Nov 25 07:58:27 EST 2002 | Yannick
Hi, I made a board wich I plated with immersion Tin, I tought it should be the same result as we had with tin lead but we ran into a weird problem. WE use a 63/37 no clean paste and on the Board with Immersion Tin the solder just make a ball ON
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