Electronics Forum | Wed Apr 07 08:30:22 EDT 2004 | Dougie
Hi, We are Scottish manufacturing company considering a move to Immersion Silver finished PWB's from HASL. The driver behind it being the RoHS and WEEE legislation in Europe at present. My question is... We plan on using a Sn/Cu/Ni solder bar in o
Electronics Forum | Wed Apr 07 09:23:20 EDT 2004 | davef
In addition to your concerns about leaching, why aren't you concerned about: * Tin whiskers * Total absence of in use reliability information about no-lead, especially given that creep is significantly different between SnPb and no-leads. While they
Electronics Forum | Wed Apr 21 17:27:27 EDT 2004 | russ
We always use the regular production reflow profile when we use this method. Since you don't want to do that, All that is required is to ramp the part up to temp to get the balls to melt. If you don't exceed 2C per sec. in a ramp you will be fine.
Electronics Forum | Wed May 12 08:35:20 EDT 2004 | solderpro
yes this paste is a pain in the paste.... there are very few reasons for solderballs, component to pad ratio and placement.... solder paste control, using a mixer, not hand mixing, checking viscosity and temp..... or simply and bad profile and your
Electronics Forum | Tue Apr 27 15:18:13 EDT 2004 | Claude_Couture
No offence, but have you ever used a soldering iron? The usage dictates the shape you need. small pads require small tips, big pads require big tips. Then you have chisel tips, cone tips, etc... that is to your preference or what you feel more comfor
Electronics Forum | Mon Apr 26 11:26:36 EDT 2004 | rob_thomas
Hi, why don't you call tech support of the manufacturer of your vibratory feeders.They will be able to help you.This is mostly a trial and error kind of adjustment and there are various "tricks" that I've noticed in various assembling plants (i.e. ke
Electronics Forum | Thu May 13 19:43:57 EDT 2004 | My Nguyen
Hello all: We looking for an effective solutions for HIGH-VOLUMN BGA RE-BALLING. (i.e. cases where we got to scrap thousands of BGA modules and re-use the chip) BGA spec. (general) W: 8mm, L: 13mm, H: 1.12 mm, No. of ball: 60, Size: 0.45mm Pitch:
Electronics Forum | Thu Mar 31 04:39:56 EST 2005 | zsolt
Hello All, we have 2 CP842 on site and they are running simply perfect. We used our existing CP feeders (with the small reel holder). CP843 can compensate pick-up both in X and Y direction. also measuring the height of the part with a laser sensor.
Electronics Forum | Fri Jun 04 21:21:04 EDT 2004 | johnwnz
Hey folks, time to put the collective brain into motion. I need to source a conformal coating machine for some medium volume production of assorted PCBA's. I'm looking for something that's easy to program, accurate, good running costs and all that g
Electronics Forum | Wed Jun 09 16:54:24 EDT 2004 | Ralf
Hi all I have a question to all of you who has experiences with Microflex MPM. There are two items: one is on contact calibration and second squeegee pressure calibration. Do i have to if i set PCB make these calibration?. Does Microflex have mechani
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