Electronics Forum: used (Page 666 of 2487)

Re: Adhesion loss on passives over wave

Electronics Forum | Thu Mar 18 17:18:22 EST 1999 | Earl Moon

| | Hi folks, | | | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and

Shorts on BGA

Electronics Forum | Mon Mar 15 08:06:46 EST 1999 | Ron Lahat

After rmoving a BGA (plastic)to correct unexplained shorts I installed another BGA using flux only. Checking on an X Ray machine and found two shorts. can anyone give a good explenation ? Thanks Ron

Re: FUJI PD naming convention Any idea?

Electronics Forum | Fri Mar 12 17:06:24 EST 1999 | Jason

| Okay, I would like to hear everyones ideas for PD naming conventions for FUJI. We are trying to use your basic names "3216_CAP" to a "MQFP208AD" But it is way out of control. Different part sizes, and vendors make it very tough to keep it all th

fr4 material

Electronics Forum | Wed Mar 10 16:18:29 EST 1999 | greg cronin

I am looking for a supplier for bare fr4 material. I use the fr4 for fixtures and my supply has run out. A supplier in the new england area would be the best. thank you

Re: fr4 material

Electronics Forum | Wed Mar 10 18:37:27 EST 1999 | Earl Moon

| I am looking for a supplier for bare fr4 material. I use the fr4 for fixtures and my supply has run out. A supplier in the new england area would be the best. | thank you | New England Laminate Co (NELCO) and Polyclad in NH. Earl Moon

Re: Wave Soldering 14 and 16 Pin SOICs

Electronics Forum | Wed Mar 10 13:53:13 EST 1999 | Vincent Vega

| We will wave solder a board with SOIC14 and SOIC16 parts on the bottom. It has been difficult to find any specific wave solder process recommendations from manufacturers of the SOICs. The pad geometry utilizes theiving pads on both sides to reduce

BGA repair/rework

Electronics Forum | Sat Mar 06 10:25:55 EST 1999 | Earl Moon

I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. Concerning the BGA stuff, I'm getting about 60% success using this rewo

Bismuth finishes

Electronics Forum | Thu Mar 04 02:17:11 EST 1999 | Teemu M�kiniemi

Hello! Does anyone know any PWB bitmuth finish suppliers? How thick layers are usually used? What pros and cons bismuth plating has in PWB applications? Teemu

Re: Makin That Drat Documentation

Electronics Forum | Sat Mar 06 08:19:50 EST 1999 | Dave F

| Clarissa, | | Dave had good suggestions. We load several boards manual at this time. We set our components up in clearly marked bins. The documentation includes a chart with the part number, bin number, reference designator and color code for t

Re: Tweezers

Electronics Forum | Tue Mar 09 13:11:00 EST 1999 | Nancy

Maybe it is all what you get use to. Our assemblers like the vacuum pen. Since we do more than passive components, some parts would be difficult to hold and line up. As for as our Fristch, we use it as a manual and just have our bins on the side.


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