Electronics Forum | Thu Apr 10 12:49:08 EDT 2003 | Giuliano
I am using the old Tango for DOS to create an board with a 1mm BGA chip. How to define clearance around the surface pads?
Electronics Forum | Mon Apr 14 09:11:31 EDT 2003 | tangch
There is a reference manual called Advanced product Quality Planning(APQP)which were widely use in automotive industry or QS certification company.Inside there has plenty of checklists which may be relevent to you.
Electronics Forum | Fri Apr 25 15:01:29 EDT 2003 | swagner
Go to http://www.gsilumonics.com we use several of their systems for both paste and component inspection and week in and week out maintain a 99.85%+ first pass yield on a no post reflow repair line.
Electronics Forum | Tue Apr 15 10:43:44 EDT 2003 | yngwie
Why is it people still prefer to do manual stirring of solder paste versus automated solder paste softener ? I learned that one of the dis-advantage of using the softener is that this method is actually seperating the metal and flux. Is there any oth
Electronics Forum | Tue Apr 27 00:18:08 EDT 2004 | Garian
Since you have used malcom softener, did you encounter and sudden rise of void level in the solder joints as compared to manual stirring?
Electronics Forum | Wed Apr 16 08:15:55 EDT 2003 | davef
Check with your temperature profile equipment supplier [eg, KIC, ECD, etc]. We use a download from ECD that lists most ovens and solder pastes that make it [or one like from another supplier] a good place to start.
Electronics Forum | Tue Apr 22 13:32:23 EDT 2003 | swagner
Does anyone have any data pertaining to contaminates baking out of a fiberglass resin pallets used for processing flex circuits? If so does this phenomena increase over time? Thanks,
Electronics Forum | Mon May 05 12:16:07 EDT 2003 | russ
A micron is 1 millionth of a meter, this term is no longer used according to my dictionary. I would have to agree with the dictionary. Anyway, 175 microns is a little more than 6.8 mils. Russ
Electronics Forum | Tue May 06 22:31:52 EDT 2003 | yukim
Yes, we did try: built a lot of 200 PCBs with Sn62Ag2 solder paste (we have been using Sn63) and it helped, but not eliminated the problem.
Electronics Forum | Fri May 16 20:55:05 EDT 2003 | jonfox
The term is still valid and used everyday by those in the die placement and "micro"-electronics world. MILS is too hard to understand at that level. Its just easier to say 10 microns than 0.3937 mils.
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