Electronics Forum: used (Page 761 of 2487)

component baking process

Electronics Forum | Tue Sep 21 06:46:58 EDT 2004 | davef

Background on activation energy for diffusion can be found: * Materials textbooks * College lectures posted on the web. Use 'google' or someother search tool. As a guideline, the higher the activation energy, the harder is is for diffusion to occur

Step stencil troubles

Electronics Forum | Fri Sep 17 03:25:45 EDT 2004 | soease

Hi all, does anyone of you use step stencils for paste application? Did anyone experienced troubles with those kind of stencils? thanks for answer sly

Step stencil troubles

Electronics Forum | Fri Sep 17 09:44:26 EDT 2004 | davef

We agree with Russ. * Haven't used them in 10+ years. * Size of keepout for the stepped apertures needs to be large. * Manipulating aperure size to manage paste volume for specific components is not difficult.

Component 0402

Electronics Forum | Wed Sep 22 22:56:44 EDT 2004 | davef

Talk to 10 people and you get 10 recommendations for pad layout. So far, here's number 3 [after IPC and AVX]. We suggest: * Use the IPC recommended standard. * Change from that standard when someone gives you a documented reason to change.

Lead Protrusion

Electronics Forum | Wed Sep 22 22:32:12 EDT 2004 | pdeuel

We use a chunkee trimmer in prep. Cut bend and form all thru hole parts before first assembly.

Ion Contamination level allowed on Connectors

Electronics Forum | Wed Sep 22 22:30:50 EDT 2004 | davef

We are aware of no such standard. You need to determine the acceptable level for your product in its use environment.

Selective soldering

Electronics Forum | Fri Sep 24 11:32:06 EDT 2004 | C Lampron

Hi John, We have been selective soldering for about two years. My suggestion is to use the same guidelines for preheat, duration and temp as you would in wave. Your flux manufacturer should be able to provide you with the details. Good Luck Chris

Pick and place labels

Electronics Forum | Thu Sep 23 11:50:54 EDT 2004 | JB

We are using a standard nozzle Once placed, the label is not flat, the ends of the label are slightly lifted on both ends. The label is .650 x .200 Have you guys run into a similar problem?

Lead free Solder Paste troubles !!!!

Electronics Forum | Wed Sep 29 15:42:25 EDT 2004 | russ

Make sure that you use lead paste and solder for this. (See Dave I listened) Russ

cellular phone assembly

Electronics Forum | Fri Sep 24 04:11:13 EDT 2004 | rob

Hi Chics, It all depends on where you are in the world - in Europe robots were used back end (Ericsson), and usually Fujis front end (Motorola, Nokia, Ericsson). In China you're obviously not going to need the Robots.... Cheers, Rob.


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