Electronics Forum | Mon Apr 06 12:57:49 EDT 2009 | jdumont
We are using Alpha's OM-338-PT with great results. The PT means pin testable which was selected because its residues are a little softer and clean slightly better.
Electronics Forum | Wed Apr 08 16:16:35 EDT 2009 | rkevin
I am looking to use a no clean and want to stick with SAC305 Steve, What would you recommend from Aim ?
Electronics Forum | Fri Jun 12 11:19:25 EDT 2009 | gregcr
we have a small heller 988 oven that has served us very well over the years. I see them cheap on the used market. Worth looking into in my opinion.
Electronics Forum | Wed Apr 15 13:03:14 EDT 2009 | toddscherrsymcomcom
I am looking for any input on the linear stick feeder from Mydata. We currently use a vibe feeder and have a high number of miss picks/rejects on SO8 packages. Is the linear stick feeder worth the investment to upgrade from vibe?
Electronics Forum | Sat Apr 18 09:44:46 EDT 2009 | davef
Low tombstone pastes have been around for 8-10 years. Talk to your paste supplier about suggestions of the "latest and greatest." Usually these pastes: * Are a blend of alloys with slightly different melting points * Have a mid-level activity flux *
Electronics Forum | Tue Apr 28 04:07:56 EDT 2009 | davepick
There's a nice tool on this site - http://www.enhancetechnical.co.uk/ Click on Internet Tools and then the image - brings up a useful interactive tools which helps understand influences on wave solder bridges. Dave
Electronics Forum | Tue Apr 28 07:45:07 EDT 2009 | davef
When using high tin solder, doesn't proper specing to avoid the effects of tin whiskers become at least as large an issue as proper specing for defect-free wave solder processing?
Electronics Forum | Thu Apr 30 14:45:28 EDT 2009 | bandjwet
Does anyone have any experience in using solder scavenging systems? We have very tight land areas for RF shields (nearest component can be 2mm away in some cases). We are aware that both SRT and AIRVAC have such systems. Thanks! BWET
Electronics Forum | Sat May 02 08:48:32 EDT 2009 | davef
You have a board defect. Any moisture and/or organic contaminants trapped by the solder resist during lamination may cause solder mask delamination, blistering and/or adhesion loss during subsequent soldering operations or during extended use.
Electronics Forum | Fri May 08 09:44:23 EDT 2009 | davef
Board fabricators use solder as a resist to protect copper traces from process chemicals. Fabricators remove this resist in later processing. It's possible that board fabrication processing is the source of the tin that you see.
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