Used SMT Equipment | X-Ray Inspection
Type: microme|x 180 SN:ANA01C0006-133908 Vintage: 2008 230 V 50/60 Hz 2000 VA 8.7 A 10 A
Used SMT Equipment | SPI / Solder Paste Inspection
Product Name: Table Top 3D SPI Model Name: KY3020T Serial Number: SPI-2T 210 Voltage: 220Va.c, 1Phase, 50/60HZ Rated Current: 0.8 Amp Current Max.: 4 Amp SCCR: 10KA/220Va.c Capacity: 0.88 kW Weight: 95 Kg Machine Size (mm): 780 x 1100 x 734 IP Grade:
Used SMT Equipment | Pick and Place/Feeders
Refurbished YAMAHA YV100XG SMT Pick and Place Machine Machine Type YV100XG Substrate size M type L460 * W335 (MAX) -L50 * W50 (MIN) L type L460 * W440 (MAX) -L50 * W50 (MIN) Mounting accuracy Absolute accuracy (μ + 3σ): ± 0
Used SMT Equipment | Chipshooters / Chip Mounters
JUKI FX-3 Pick and Place machine Specification Substrate dimension: L- substrate-(410×360mm) L-wide substrate-(510×360mm)*1 XL substrate-(610×560mm) Component Height:6mm size Component range : laser discrimination radar system,0402(British 01005) ~
Used SMT Equipment | Chipshooters / Chip Mounters
Model:YG12 Placement Speed:36000cph(0.1sec/CHIP Equivalent) Placement Range:0402(Metric base )to□20mm Power Supply:AC220V-380V(50/60HZ) Dimensions:L1254XW1440XH1450mm Weight:1340kg
Used SMT Equipment | SMT Equipment
Model :JX-200 Pick and Place Machine Placement speed：Chips:18050CPH(0.199sec/chip) Component mount range:0603 chips ~33.5mm Station:60 Power supply:3-phase AC200~415C 4KVA/12KVA Size:1880*1731*1490mm Weight:2100kg
Used SMT Equipment | SMT Equipment
Model :JX-100LED Pick and Place Machine Placement speed：Chips:19300CPH(0.187sec/chip) Component mount range:0603 chips ~33.5mm Station:30/60 Power supply:3-phase AC200~415C 1.5KVA Size:1390*1270*1440mm Weight:1000kg
Used SMT Equipment | SMT Equipment
Model:YG300 SMT Pick and Place Machine Placement Speed:105,000cph(0.034sec/CHIP Equivalent ) Placement Range:0402(Metric base )to□14mm Power Supply:AC220V-380V(50/60HZ) Dimensions:L2770XW2118 Weight:4.400kg
Used SMT Equipment | Pick and Place/Feeders
JUKI FX-3 Pick and Place machine Specification Substrate dimension: L- substrate-(410×360mm) L-wide substrate-(510×360mm)*1 XL substrate-(610×560mm) Component Height:6mm size Component range : laser discrimination rada
Used SMT Equipment | Chipshooters / Chip Mounters
Refurbished YV180XG Pick and Place Machine Panel size L Type: Max L380 x W330 mm ∼ Min L50 x W50 mm Panel thick 0.4 ~ 3.0 mm Mounting ±0.05 mm (0.01mm control) Mounting angle ±180° (0.01° control) Mounting speed 0.095 se
