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Jun 12, 2014 | I am looking into Vapor Phase with Vacuum and Inline Reflow with Vacuum (besides Heller I believe a German company SMT has something comparable). There are a couple of companies I found that make vacuum ovens for soldering of hybrid microelectronics. Their design (enclosed thick walled st. steel chamber with a top hatch) looks like it can achieve ultra vacuum. I realize that for SMT reflow this would be excessive. Just wanted to get an idea of the vacuum level needed to have reduced voiding (within a few %). Also, if the vacuum generated at the molten state of solder has any negative effects Vacuum Soldering
Jun 12, 2014 | I don't fully understand what you are trying to do... 1. Reflow Solder in a Vacuum Temp Chamber 2. Vapor Phase / Condensation Solder with Vacuum 3. Contact Heat system with Vacuum 4. Inline Reflow Oven with Vacuum ... or what you are trying to solder... Systems made for reflowing solder (2 -4) normally top out around 0.1mBar but I haven't seen very much info on the Inline Reflow with Vacuum (4). Heller is the only Manufacturer I know that provides it... but I have not looked very hard. Vacuum Soldering
Jun 26, 2018 | Vacuum Reflow Oven Minami vacuum reflow is easy to maintain air tightness, and oxygen can be reduced to 50ppm or less by filling N2 gas. And generation of oxide film can be suppressed, and production in low oxygen environment is possible. In addition to the air tightness, vacuum void-less function is equipped in the reflow zone. Air bubbles (voids) in BGA and CSP, which basically could not be reduced in the past, can be eliminated by sucking in the vacuum chamber, and uniform bumps without voids can be formed. We need more details of the target boards to run and its component including the solder paste to use
Jun 11, 2014 | Is anyone running reflowing in a vacuum oven to achieve void free connections? If so, are there any issues you are experiencing with this process? What level / measurement of vacuum that you need to achieve for good results? Vacuum Soldering
May 25, 2010 | Reflow Oven with Vacuum System Vacuum Soldering is mostly available with Vapor Phase Soldering systems as a option. Asscon / IBL / Rehm Thermal all offer this... Rehms system is unique as they offer in place solder and vacuum vs the other two vendors that move a PCB with Molten Solder into a seperate Vac Chamber. Rehms system also has many other process benefits over other Vapor Phase methods... Vacuum does reduce or remove voids, can also control wetting to a degree. Of course too much Vacuum is not good either so system needs to have good control for user and process tuning.
May 24, 2010 | Reflow Oven with Vacuum System Has anyone here specially the Gurus heard, used or seen a Reflow Oven with Vacuum? Is the result really good when it comes to reducing Voids? Can you share any info about this oven? thanks and regards...
May 3, 2018 | Vacuum Reflow Oven Can anyone advise on the approximate cost of a reflow oven with vacuum? Just looking for a ballpark number to see if it feasible for us.
May 11, 2018 | Vacuum Reflow Oven Rehm Thermal Systems (Germany)offer in process vacuum reflow in convection ovens and vapor phase pending what makes sense - volumes of PCB per hour needed. There are other vendors getting into this of course. Can only get single digit void free joints with asssiatnce, anti void pastes will gte some way with good DFM,Stencil and reflow profile, but < 10% would be tough ask without machine assistance in reflow process.
Jun 9, 2010 | Reflow Oven with Vacuum System We have been doing pilot runs with vacuum installed on vapor phase. Voids are down but bridges are up on the .5mil BGAs.
May 25, 2010 | i'm really intrested in that as well, because we are having some issues with our Rebel Led's
May 3, 2018 | Also, are there any other industry practices for void reduction? I read that Nitrogen helps.
Jul 18, 2002 | PCb vacuum seal puncture Experts, Today I received PCB in a punctured vacuum seal bag. the Humidity indicator change the colour to pink at 60%RH mark. The brd finish is Entek. Earlier our intention to get the board vacuum seal is because we want to ensure that the is no friction in between the 2 entek surface which could damage the Entek coating. I'm not sure if baking is the right decision or not as from what i know this will eliminate blisstering at reflow should the board absorb enough moisture. On the other hand, baking the Entek brd could degrade the entek quality thus leads to solderability issue. Pls advsie what
Jan 10, 2000 | HELLO MIKE, THE PROBLEM WITH THE VIA BEING IN THE MIDDLE OF THE PAD CAN BE HANDLED. IF YOU ARE HAVING PROBLEMS WITH SOLDER FLOWING THROUGH AT REFLOW YOU MIGHT WANT TO CHECK YOUR VACUUM AT YOU SCREEN PRINTER. SOMETIMES THE VACUUM THAT HOLDS THE PCB DURING THE PRINTING PULLS THE PASTE INTO THE VIA
May 7, 2019 | How to reduce solder joint voids of LED without using vacuum reflow? I have personally never seen a reflow profile change reduce voids. We have invited "experts" in to demonstrate this claim. They were unable to.
May 27, 2019 | How to reduce solder joint voids of LED without using vacuum reflow? Dear Sr.Tech, We tried to adjust the soak time and TAL time of reflow profile, but it doesn’t seem to help much.
May 27, 2019 | How to reduce solder joint voids of LED without using vacuum reflow? Dear Steve, We already to do some DOE of reflow profile, but the optimized parameters are not help for the reduction of voids.
May 27, 2019 | How to reduce solder joint voids of LED without using vacuum reflow? Dear CW, Yes, we also tested many different brands and models of solder paste, under the same stencil design and reflow profile the condition of the voids will have great difference.
Jun 27, 2014 | Is this fluxed / solder paste or flux-less reflow process? Are you soldering in a nitrogen or vacuum oven? From my experience having gold-tin connections go through reflow a 2nd time does not yield defects or quality issues. However, I cannot comment on the impact of long term reliability Gold/Tin Reflow
May 28, 2019 | How to reduce solder joint voids of LED without using vacuum reflow? Solder paste flux is main contributor, Lead termination chemical-oxide by products and PCB Plating-Chemicals. Reflow profile would have very limited if not no impact really unless is way off. Paste volume control and Stencil design plays a big part Paste Type-FLux plays a Part Device Pad layout and interconnect plays a part Maybe get 20%-25% Voiding with above optimised is possible Getting 10% or less doubt possible without Vacuum soldering. In EU at major OEMS in car biz this is all the rage Vacuum Soldering inside your convection oven in process. Pricy Machines but 2% or less can be reached. Major
Dec 16, 2002 | No parts or boards are baked unless they are moisture sensitive and were left out too long and that is for reflow only. In your case there should be no reason to bake becouse the boards should be vacuum packed as they come in as well as any moisture sensitive parts.
May 16, 2005 | BGA rework: Coplanarity of Xilinx before and after reflow. This has been a problem with new components coming directly from vacuum sealed desiccant packed moisture barrier bags with moisture level cards. We have also baked all boards prior to the BGA rework to ensure no moisture issues were addressed.
May 6, 2018 | Thanks for the feedback. I was looking into solder pastes and saw some advertised specifically for
May 27, 2019 | Dear Steve, Thanks for your feedback in our experience add solder paste volume is better for the vo
Jun 1, 2019 | Increase paste volume and use ramp soak spike profiling. Reducing volume of paste often leads to ent
May 6, 2019 | How to reduce solder joint voids of LED without using vacuum reflow? Hello! Do you have a better stencil design to reduce the large area of solder joint voids? Or is there a suggested way to set the reflow profile? Or are there other process improvements to make the solder joint at the LED pad less than 10% per void? Thanks a lot.
Mar 17, 2017 | I think the main driver is MTBF data driven by the Car OEMS, mainly german makers pushing this onto suppliers in supply chain. Vacuum soldering and void reduction is a hot topic for the leading electronics suppliers in Germany at the moment. Is not related to and IPC type standards, it is more driven from internal IP of car OEMs. Yes power electronics and led would be main applications I would suspect. Rehm Thermal Systems is leader in inline reflow ovens offering proven solutions for several years due to their high exposure to the Auto Industry demands and this is their strongest , main market share. Vacuum Soldering can also be done in Vapor phase, again this was championed by Rehm before most other vendors, due again being close to where lower and lower void quality requirement demands are coming from... Paste flux does contribute so much to reducing voids and more work in this area
Jan 13, 2004 | A small benchtop system uses a mask, tooled for your part, to arrange the solder spheres onto the BGA, after it has had the excess solder heat-vacuumed off and a new layer of flux applied. The spheres are poured into the cavity, excess decanted off. Then the part is placed on a small mini -oven suited for taking the BGA up thru the reflow profile and back down. Send me an email to discuss where to get this equipment.
May 8, 2005 | BGA & QFP post reflow inspection Hello mrmaint You say that you do 100% incoming inspection at your site, Do you open every tray and look on the writing on every type of component? If you open the bag, how do you close it again (vacuum machine)? What is the inspection process? (Only for component that come in trays) How do you
Aug 9, 2006 | Paste-in-Hole reflow soldering You are going to struggle with that sort of connector - the only pin headers that seem to have widespread sucess are the dual inline ones with bent over j leads that sit on the board. They come with a plastic hat that allows vacuum pick up. However... they are not polarised, have no friction
Aug 21, 2006 | Vapor Pressure at lead free reflow temperatures 't have the facility to bake & vacuum seal components in house it is worth talking to your suppliers to ship in smaller pack sizes. I hope that is of help, Rob.
Mar 26, 2007 | Intrusive reflow "If they complain just tell them it�s no different than finding the stray smt components that appear from time to time and makes me wonder why no one complains about them." Because they know, even as they're vacuuming up those stray Rs and Cs, that somewhere, sometime, someone ELSE is going to get
Sep 24, 2007 | I am doing some research on flux free/flux less SMT reflow soldering. Do you have any equipent/process recommendations? Does anybody use it for volume production and what are the constraints (finish, balls, paste, vacuum, pressure, size)? What is a good source for literature. I could not find
Feb 7, 2008 | SMT Exhaust Vacuum Monitor Here is another visual. http://www.metacafe.com/watch/416435/computer_fan_generator/ Only issue with a PC fan is I'm positive that the blades will melt while enduring the heat of the reflow oven
Jun 17, 2008 | But don't you need to control the rate of the drop in pressure? I'd think if you pull down quickly it just results in the same popcorning you'd see in a reflow oven. I just know it's not hard to boil water in a vacuum chamber. For that matter, it's not hard to freeze it, and it's even more fun
Feb 3, 2017 | Reflow Oven Brand read about vacuum soldering, there are vapor phase machines that keep improving.....
May 7, 2019 | Probably just means you started out with an optimal profile. I suspect that not everyone does. ;)
May 9, 2019 | Hi, You can work on improving stencil design, having the perfect profile and other process improve
May 26, 1998 | | We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg. C after the first side of the board is reflow solder and cleaned. | Does anyone know of any studies to indicate either of the following: | 1. Is baking after the first side of the board is solder and cleaned really necessary if the board is processed within the time frame recommended for moisture sensittive parts? | 2. Does vacuum baking reduce the cycle time for moisture bakeout? If yes, what vacuum ovens are recommended and what is the bakeout schedule? | Thanks, Pete, Not to pry but whatcha buildin'? If that's proprietary, no big deal. The reason I ask is because when I have built stuff for the medical industry, for example, I have to follow
Jun 11, 2003 | correct "Nozzle Type" is used for size or type of component used. 3. Nozzle Tip Dirty- Perform nozzle maintenance and necessary calibrations afterwards 4. Nozzle Position- Nozzle not installed correctly check vacuum port hole is facing outward. This is the upper portion of the nozzle. 5. Nozzle Vacuum Holes Clogged - check for grease in vacuum hole, also ensure nozzles do not have solder paste or glue inside of them. After cleaning perform necessary lighting and nozzle offset calibrations. 6. Nozzle Movement Sluggish- Clean nozzle and ensure nozzles slide up/down with free movement, replace nozzle if needed. 7. Vacuum Filters- Replace dirty filters, check that two filters are installed correctly (Qty 1 filter for Vacuum and Qty 1 filter for Airkiss). Reference maintenance manual for the to types of Filter Retainers. Ensure that the type on your machine is installed as prescribed in section 1.4 page 1
Apr 4, 2004 | and nitrogen atmosphere (while the nitrogen purge is ongoing) so that over time O2 is in the desired <20ppm range. Is vacuum also the standard process in reflow ovens or is it that nitrogen is continuously purged into the chambers until the desaired O2 atmosphere is achieved; and then we feed the boards Nitrogen Reflow Oven We are looking at several reflow ovens with intent to acquire one for both air and nitrogen reflow capability (i.e. have the capability to reflow in either air or nitrogen environment). Would be interested to know what I should look for in comparing the N2 capable ovens. Do all the ovens feed N
Apr 5, 2004 | Nitrogen Reflow Oven Low-consumption Nitrogen configurations with an on-board O2 analyzer is the ideal way to go. I cannot speak for all oven manufacturers, but ours have N2 fed to the reflow zone only, which to me is really only where you need it. The gauges/flowmeters that you are referring to are more than likely just like you said; A flowmeter for the zone. I believe vacuum may have been used on older designs, but now I believe it is more a purging of the Oxygen by pushing Nitrogen into the tunnel. I think it will depend on the oven design itself that will dictate how long it will take before the O2 count
Apr 14, 2014 | Cleaning old built up flux residues from reflow oven If you do a search on Reflow Oven Cleaning Fluid, you will find links to companies and chemicals that can assist you. I recommend that you contact one or more of the companies and discuss your needs and the paste you are using. They should be able to help you procure a cleaning agent for your oven . Vacuum out what is crystalized and scrape out what is not solidified before you go in with the chemicals. Expect it to take time and elbow grease to get your machine clean. You can probably get most of the contamination out, but not all of it.
May 26, 1998 | We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg. C after the first side of the board is reflow solder and cleaned. Does anyone know of any studies to indicate either of the following: 1. Is baking after the first side of the board is solder and cleaned really necessary if the board is processed within the time frame recommended for moisture sensittive parts? 2. Does vacuum baking reduce the cycle time for moisture bakeout? If yes, what vacuum ovens are recommended and what is the bakeout schedule? Thanks,
Jan 10, 2005 | level for reflow. The best solution is to bake them for a longer period of time. The upcoming revision of J-STD-033 will propose an extended bake cycle of 96 hours at 125C for PBGAs. The real effect of vacuum on component drying is still a subject of controversy in the industry and it is not endorsed Vacuum Bake out of plastic BGAs
Aug 29, 2006 | With the UP2000 that has vacuum board hold down, the Grid Loc hoses defeat the vacuum in order for them to exit the work table. Big boards require more girds, thus more hoses. Set-up between large and small boards takes time to remove or add the grids. Getting initial set-up required big bean bag had a big affect on your print. We had 1 misprint outta about every 5 because the Grid-Loc would hit on an IC leg or half on/off a part. This would cause the board to move. Not all ICs and parts reflow in the exact same spot, thus causing the board to slip. Perhaps if we had side
Feb 7, 2008 | SMT Exhaust Vacuum Monitor Does anyone use or have any simple wave/reflow oven exhaust monitors with a visual check (LED). I was going to design something crude resembling a fan with an electric winding (electric motor of sorts)and a load (resistor maybe with a transistor if needed) attached to an LED. I would need something that wouldn't activate the LED at low RPMs (due to heated air causing convected air flow) but would illuminate at higher RPMs signifying that the vacuum created suction is present. If there aren't plug and play devices that are like this does anyone have any good sources/vendors that may have
Jun 23, 1999 | | | We are reflowing boards that have glop top components | mounted on them. Do glop tops have the same moisture | sensitivity as fine pitch? Should we be baking the boards | prior to reflow? | |If your glob tops are PBGAs, they are likely very moisture sensitive. Check on how they are supplied from your vendor. All manufacturers and any reputable reseller will properly package any moisture sensitive component in a vacuum packed, heat sealed bag with desiccant packs and a RH indicator card inside. The label on the bag will state the sensitivity level (3,4...) indicating the allowable time out of the bag. If the components are handled properly before reflow you don't have to worry. If they are not, it would be advisable to bake the component before mounting and reflow. The primary reason to bake the board would be if you wanted to remove, reball and reuse the moisture sensitive
May 26, 1998 | | We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg. C after the first side of the board is reflow solder and cleaned. | Does anyone know of any studies to indicate either of the following: | 1. Is baking after the first side of the board is solder and cleaned really necessary if the board is processed within the time frame recommended for moisture sensittive parts? | 2. Does vacuum baking reduce the cycle time for moisture bakeout? If yes, what vacuum ovens are recommended and what is the bakeout schedule? | Thanks, I don't know if I'm reading you right, but it seems excessive to bake after first side soldering. It seems more likely to bake after completing assembly as moisture is gradually built
Aug 17, 2002 | , like the wheels falling off a machine. * First-side components waiting for second side reflow. * SMT components waiting for wave soldering. * Opened dry-packs that were not consumed, but will be used some other time. A couple more questions then. 1. Does vacuum sealed packing not stop this or does it only reduce it. <= We vacuum seal not consumed material from opened dry packs, after they are baked, prior to their return to stock. It�s rare for us to vacuum seal in-process material. A line has to be unplanned going-down hard for that to be done. 2. If there was a small economical nitrogen
May 26, 1998 | | | We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg. C after the first side of the board is reflow solder and cleaned. | | Does anyone know of any studies to indicate either of the following: | | 1. Is baking after the first side of the board is solder and cleaned really necessary if the board is processed within the time frame recommended for moisture sensittive parts? | | 2. Does vacuum baking reduce the cycle time for moisture bakeout? If yes, what vacuum ovens are recommended and what is the bakeout schedule? | | Thanks, | Pete, | Not to pry but whatcha buildin'? If that's proprietary, no big deal. The reason I ask is because when I have built stuff for the medical industry, for example
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