Electronics Forum: vacuum chamber (Page 1 of 4)

Baking MSL components in vacuum.

Electronics Forum | Tue Jan 09 08:46:03 EST 2018 | pavel_murtishev

Hi, "Baker with controlled humidity 5%" is actually dry cabinet. Using of dry cabinets i.e. ambient temperature baking is preferred. Vacuum will always be better. If you are going to use vacuum chamber, that will be the best method in my opinion.

Glue Bubbles

Electronics Forum | Wed Apr 07 14:12:53 EDT 2004 | Paul

The easiest way to remove air bubbles from any fluid is to place it into a vacuum chamber. I do this almost daily with liquid rubber coatings, glues, and plastics.

Vacuum Bags

Electronics Forum | Wed May 16 13:40:19 EDT 2007 | slthomas

"I read a study a while back by IBM that showed too strong a vacuum would cause too much moisture to enter the bags." That's what the nitrogen is for. If you pull a vacuum w/o backfilling with something dry, like nitrogen, pretty soon the vacuum ove

Baking components at 70 degree

Electronics Forum | Tue Jun 17 15:35:12 EDT 2008 | slthomas

But don't you need to control the rate of the drop in pressure? I'd think if you pull down quickly it just results in the same popcorning you'd see in a reflow oven. I just know it's not hard to boil water in a vacuum chamber. For that matter, it's

Vacuum Reflow Oven

Electronics Forum | Tue Jun 26 16:07:12 EDT 2018 | eduszapata29

Minami vacuum reflow is easy to maintain air tightness, and oxygen can be reduced to 50ppm or less by filling N2 gas. And generation of oxide film can be suppressed, and production in low oxygen environment is possible. In addition to the air tightne

Re: Moisture Bake-out of Plastic Parts

Electronics Forum | Tue May 26 12:25:34 EDT 1998 | Wayne

Vacuum Bakeout Ovens For many years vacuum bakeout ovens have been used in the hybrid industry for removal of moisture from ceramic cercuits prior to hermetically sealing packages. In this process the vacuum oven certainly reduces the bakeout cycle

Vacuum Soldering

Electronics Forum | Thu Jun 12 08:35:25 EDT 2014 | jax

I don't fully understand what you are trying to do... 1. Reflow Solder in a Vacuum Temp Chamber 2. Vapor Phase / Condensation Solder with Vacuum 3. Contact Heat system with Vacuum 4. Inline Reflow Oven with Vacuum ... or what you are trying to sold

Parylene Coated BGA Rework

Electronics Forum | Thu Apr 10 17:44:22 EDT 2003 | davef

Q1: Can they be masked so parylene doesn't get underneath? A1: Your parylene applyer may be able to mask area, but in general no. This stuff is cured in a vacuum chamber to make sure that it gets into every past corner. Q2: How do you remove and re

Parylene Coating

Electronics Forum | Mon Apr 26 15:10:46 EDT 2004 | pjc

Parylene coating is done in vacuum curing chambers. This process drives the material under components and into all nooks and crannies. There is nowhere on the board assembly that can escape from the material! I've only seen Parylene coating process u

Vapor Phase Ovens

Electronics Forum | Fri Jan 31 06:22:05 EST 2020 | tamasmagyar

Hi chapeshiel, I had at my former workplace 2 pcs Rehm oven with vacuum system, and did not work properly. Loads of hours of downtime with servicing because the conveyor system is separated in the vacuum area from the main conveyor system, and the t

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