Electronics Forum | Mon Dec 22 13:54:25 EST 2014 | proceng1
My customer made a process change to overcome a design flaw. The PCB assembly mounts in a plastic housing. The PCB mounts to the front housing via plastic stand-offs. They had to change a connector on the back side of the assembly due to long term
Electronics Forum | Wed Feb 25 09:09:24 EST 2015 | spoiltforchoice
Are we talking a professional device that takes something like the Squink/Voltare/EX1 projects on Kickstarter and delivers something that could be confidently used commerically? Would it be strictly a prototyping tool or would it also be suited to lo
Electronics Forum | Fri Dec 04 05:47:57 EST 2015 | rushpcbuk
In PCB design, a BGA (Ball Grid Array) package typically determines the number of layers that a Printed Circuit Board should have. However, the 4-layer board with a BGA package is commonly used than a 2-layer than an 8-layer PCB. On the other hand, t
Electronics Forum | Thu Jun 02 22:40:13 EDT 2016 | slouis2014
Hi, yes have a few experiments initially i tried to increase the solder volume but component pin have insufficient solder. 1. The solder coverage do you calculate it by solder volume or solder area. 2. if i would achieve as you recommend 50-60 % woul
Electronics Forum | Thu May 30 09:33:15 EDT 2019 | emeto
Contributors in order of importance: 1. PCB design - if you have large thermal pads, a grid of via holes should be created. Components with low profile will not let the gas to escape from the joint. The only way is going down. 2. Reduce paste volum
Electronics Forum | Thu May 04 01:52:17 EDT 2023 | davef
Look at IPC-7526 - Stencil and Misprinted Board Cleaning Handbook, Misprinted Circuit Board CleaningCLEANING [ https://www.multi-circuit-boards.eu/fileadmin/user_upload/downloads/leiterplatten_design-hilfe/ipc-7526.pdf ] ITW/EAE says "Typically, th
Electronics Forum | Mon May 25 23:26:19 EDT 1998 | Jon Gruett
I agree with Mike. They are a dead issue. As a manufacutrer's rep for many types of equipment and 11 years in the engineering field I have seen several attempts to revive the technology (if you can call that technology). Most if not all attemptds
Electronics Forum | Sat Oct 02 20:19:19 EDT 1999 | John Dwinell
| | I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Ir
Electronics Forum | Wed Dec 30 09:47:52 EST 1998 | Paul M
Hi All, I work with CNC Routers . I use full perimeter routing of double sided populated panels, in a high volume/ mix application environment. We chose stand alone routing machines for our facility . I'm interested in your input for better ideas
Electronics Forum | Tue Nov 14 18:38:59 EST 2006 | Brandon
Hello all, I am having an issue with some boards on our Wave Solder. It is a Pb free wave and These particular boards are exibiting A LOT of what I call solder bubbles in the larger than usual vias and un-used thru holes. Settings: 4 inch/min 144c to
