Electronics Forum: via and fillet (Page 1 of 15)

via tenting and pluging

Electronics Forum | Fri Nov 03 02:32:56 EST 2006 | shivam

HI ALL, can anybody clear me what is via tenting and via pluging?? second one, if i use via in pad for an.5mm bga what care i should taken, what should be the soldermask open in top and innerlayers for via?how it will directly connect to top layer

via tenting and pluging

Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef

Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug

QFN Side fillet

Electronics Forum | Fri Jul 19 13:09:55 EDT 2019 | edhare

Hi, Are you referring to the condition illustrated here? ... https://www.semlab.com/qfn-solder-fillets In this case, the solder was wicked down an attached un-filled PTH via. Ed Hare SEM Lab, Inc.

Re: 2 questions: via tenting and annular ring terminology.

Electronics Forum | Wed Jul 07 09:47:41 EDT 1999 | Peter Brant

Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. WIth regards to this question, and scott's follow up, I have used the "epoxy me

Re: 2 questions: via tenting and annular ring terminology.

Electronics Forum | Wed Jul 07 10:25:13 EDT 1999 | John Thorup

Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. John, It depends......mainly on the via size. Tenting works on smaller vi

2 questions: via tenting and annular ring terminology.

Electronics Forum | Tue Jul 06 19:38:01 EDT 1999 | John

Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. Q #2) When speaking of annular rings, I have always thought of them as minimums. Su

Re: 2 questions: via tenting and annular ring terminology.

Electronics Forum | Wed Jul 07 00:28:59 EDT 1999 | Scott Cook

Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. John, It depends......mainly on the via size. Tenting works on smaller vias. Tent

Re: 2 questions: via tenting and annular ring terminology.

Electronics Forum | Wed Jul 07 13:41:42 EDT 1999 | Dave F

snip If you go for plugging be sure you have a protrusion spec that you can live with. This often results in little bumps of epoxy that can interfere with component placement. For us, tenting .015 vias usually gets us about 80% coverage from

Blow Holes voids in solder fillet on caps

Electronics Forum | Thu Jun 28 09:57:50 EDT 2012 | mosborne1

blow holes and via holes are almost always caused by moisture and in PTH they could be moisture and improper drilled holes. If you are seeing solder balls next to the parts than I would say you have a reflow profile problem. Are you using any kind of

Blow Holes voids in solder fillet on caps

Electronics Forum | Thu Jun 28 17:05:46 EDT 2012 | davef

Here’s what we seem to know: * There’s a problem with voiding in the solder connections of SMT capacitors * A void is an open area caused by air or process fluid that is trapped within a solder connection * Voids are an allowable condition as long as

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