Electronics Forum: via and gas (Page 1 of 12)

Nitrogen gas and Tombstone defect

Electronics Forum | Mon Nov 21 10:12:11 EST 2011 | callckq

All, I try to find explanation(Article)on how Nitrogen gas can make tombstone defect even worst. However, I can't find one in the net. Anyone that has this information or article, appreciate if you can share with me...Thanks in advance.

Nitrogen gas and Tombstone defect

Electronics Forum | Mon Nov 21 16:34:03 EST 2011 | davef

Google: nitrogen reflow tombstone https://www.google.com/search?q=nitrogen+reflow+tombstone&ie=utf-8&oe=utf-8&aq=t&rls=org.mozilla:en-US:official&client=firefox-a

Nitrogen gas and Tombstone defect

Electronics Forum | Thu Nov 24 07:41:33 EST 2011 | davef

Here's a paper from the SMTnet Newsletter http://www.smtnet.com/library/files/upload/dispelling_10_myths_about_nitrogen_reflow__andy_mackie.pdf

Nitrogen gas and Tombstone defect

Electronics Forum | Tue Nov 29 14:57:45 EST 2011 | jlawson

Sorry on N2 and tombstone, many other aspects cause tombstones and n2 in itself does not cause tombstones. It can help make other bad variables tip over edge to cause tombstones more than with no N2. Get these right then N2 is not issue.

Nitrogen gas and Tombstone defect

Electronics Forum | Tue Nov 29 14:55:17 EST 2011 | jlawson

N2 is a reflow process widener so to speak, for leaded reflow less of a impact, for LF more impact, and if using finer LF solder pastes T4,T5 and smaller paste deposits generally, it helps widen window for flux in paste in oxide protection during soa

Nitrogen gas and Tombstone defect

Electronics Forum | Mon Nov 21 10:51:12 EST 2011 | scottp

I've never seen a good article with a definitive explanation - just speculation that the increased wetting forces due to nitrogen result in increased tombstones. My own experience is that nitrogen is a very minor contributor to tombstones and can pr

via tenting and pluging

Electronics Forum | Fri Nov 03 02:32:56 EST 2006 | shivam

HI ALL, can anybody clear me what is via tenting and via pluging?? second one, if i use via in pad for an.5mm bga what care i should taken, what should be the soldermask open in top and innerlayers for via?how it will directly connect to top layer

via tenting and pluging

Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef

Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug

Re: 2 questions: via tenting and annular ring terminology.

Electronics Forum | Wed Jul 07 09:47:41 EDT 1999 | Peter Brant

| | Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. WIth regards to this question, and scott's follow up, I have used the "epoxy me

Re: 2 questions: via tenting and annular ring terminology.

Electronics Forum | Wed Jul 07 10:25:13 EDT 1999 | John Thorup

| | Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. | | John, | It depends......mainly on the via size. Tenting works on smaller vi

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