Electronics Forum: via and pad and clearance (Page 1 of 3)

via tenting and pluging

Electronics Forum | Fri Nov 03 02:32:56 EST 2006 | shivam

HI ALL, can anybody clear me what is via tenting and via pluging?? second one, if i use via in pad for an.5mm bga what care i should taken, what should be the soldermask open in top and innerlayers for via?how it will directly connect to top layer

2 questions: via tenting and annular ring terminology.

Electronics Forum | Tue Jul 06 19:38:01 EDT 1999 | John

Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. Q #2) When speaking of annular rings, I have always thought of them as minimums. Su

Re: 2 questions: via tenting and annular ring terminology.

Electronics Forum | Wed Jul 07 10:25:13 EDT 1999 | John Thorup

Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. John, It depends......mainly on the via size. Tenting works on smaller vi

Re: 2 questions: via tenting and annular ring terminology.

Electronics Forum | Wed Jul 07 00:28:59 EDT 1999 | Scott Cook

Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. John, It depends......mainly on the via size. Tenting works on smaller vias. Tent

0402 pad and stencil aperture design

Electronics Forum | Thu Oct 30 22:29:58 EDT 2008 | davef

For most applications, a nice square [or rectangle] pad works just fine. Assemblers ship boat loads of boards with these every day. It's reasonable for tight decoupling capacitor requirement applications to use round or radiused pads for components

Re: 2 questions: via tenting and annular ring terminology.

Electronics Forum | Wed Jul 07 09:47:41 EDT 1999 | Peter Brant

Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. WIth regards to this question, and scott's follow up, I have used the "epoxy me

BGA rework and inspection

Electronics Forum | Thu May 30 10:31:03 EDT 2002 | robbied

Hi Yannick. This is an issue that we are just recently getting into but here is some ifo that I have gathered so far. I have seen/ used 2 different rework machines. The one we have bought is a 'PACE TF2000' which was at the lower cost end of the mar

Clearance between Through hole and chip component

Electronics Forum | Tue Feb 27 11:03:09 EST 2007 | Marcin

Hi All, Anybody knows what is the minimum clearance between through hole component and chip component? Problem description: On bottom side of my pcb are only 0603 chip components mounted on glue. One of the component is located very close to hole

Clearance between Through hole and chip component

Electronics Forum | Tue Feb 27 20:53:10 EST 2007 | davef

We'll guarantee the two pads are too close together. The proper spacing depends on the orientation of the parts to the wave. * Do the pads hit the wave at the same time? * Does one pad hit the wave before the other? If so, which? * How does the 06

Re: Solder mask materials and equitements wanted

Electronics Forum | Sat Aug 29 08:43:35 EDT 1998 | Dave F

Hi, Friends, Could you please recommend me some solder mask materials and equitements for high quality solder mask? Details such as company name, phone numer et al are welcomed. Thanks! Have a good day Xingsheng Xingsheng: Consider the follo

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