via hole tenting

"via hole tenting" search results in the Electronics Forums



523 results found for "via hole tenting" in the Electronics Forums

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QFN84 Solder Printing Issue (QFN with Inner LGA Pad)

Dec 1, 2017 | Recommended land and solder pattern says: VIA wall plating, via holes should be tented with solder

Micro Solder Balls and Vias bridging Issue

Mar 3, 2015 | I would presume you reflow the top of the board first. Use tented vias. As you have worked out, vias

SMD Via hole design-thermal performance

Nov 1, 2014 | Papers: GOOGLE thermal pad via

SMD Via hole design-thermal performance

Oct 3, 2014 | Does anyone well know in "via hole design in ground pad" I have few question that i want to know th

QFN PCB Pad no Drain Hole

May 18, 2013 |

Dealing with BGA solder ball in via hole

Mar 24, 2011 | Can you jumper the via to the pad?

via capping

Jan 27, 2010 | > What material is used to cap a via? Is it the > standard LPI Process/Material? we tent

via capping

Jan 11, 2010 | SR1000 is commonly used for tenting. Search the fine SMTnet Archives on : tenting Someone gave u

Plugging of via through holes

Jul 23, 2008 | Hello, We are using a PCB with thickness 3.2mm 4 layer and lot of through hole via's of diameter 0.

Tented Via's

Feb 25, 2008 | Rather than having the artwork cover the via as with tenting dry film, and letting the mask do what

Tented Via's

Feb 22, 2008 | Steve, Trying to keep wave solder from coming up the via' from the bottom and adhering to the via

Tented Via's

Feb 22, 2008 |

Tented Via's

Feb 21, 2008 |

Tented Via's

Feb 21, 2008 | If the vias are large and don't always tent, you can have your pcb supplier double mask the pcb. I

Tented Via's

Feb 21, 2008 | KRIKIES! tenting WILL inhibit solder flow through the top-side me lad. In the meantime, me chap,

Tented Via's

Feb 21, 2008 |

Tented Via's

Feb 21, 2008 |

Tented Via's

Feb 21, 2008 | I asume you're not ICT-ing this board and using the vias for test points?

Tented Via's

Feb 20, 2008 | Tented vias have solved problems for me in the past, but never created any. I have heard seeming

Tented Via's

Feb 20, 2008 |

ICT Question, Via holes and Probes

Apr 27, 2007 | Pete, is there a probe-style that will accomodate a via that's filled, but a little concave (inward)

ICT Question, Via holes and Probes

Apr 27, 2007 | For those of you who use via holes as test points, and the via holes must be filled at the wave, is

via tenting and pluging

Nov 3, 2006 | Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered

via tenting and pluging

Nov 3, 2006 | HI ALL, can anybody clear me what is via tenting and via pluging?? second one, if i use via in

Via holes and Wave Solder

Mar 13, 2006 |

Via holes and Wave Solder

Mar 13, 2006 |

Via holes and Wave Solder

Mar 13, 2006 |

Via holes and Wave Solder

Mar 13, 2006 |

Via holes and Wave Solder

Mar 13, 2006 |

Via holes and Wave Solder

Mar 7, 2006 | Samir, From experience, the only board test situation where tented via's have difficulty with conta

Via holes and Wave Solder

Mar 7, 2006 | Our ICT Guy here at my company loves to use lots of via holes as test points - via holes which are 0

Tented vias on ENIG boards

Feb 6, 2006 | Sorry. I actually should clarify those slides. Black pad is not associated with tented vias. Also

Tented vias on ENIG boards

Feb 1, 2006 | I wonder if they are concerned about getting chemicals trapped in the tented vias. If the tented vi

Via tenting/filling with BGAs

Mar 23, 2005 | I ran into this yesterday. Seems some designer decided to not solder resist the via's on the solder

Via tenting/filling with BGAs

Mar 22, 2005 | Q1. What are you guys doing for filled/tented/plugged vias on the BGA site? A2. 2221A, 4.5.1 tells

Via tenting/filling with BGAs

Mar 22, 2005 | Morning all, my question is regarding the use of filled/tented/plugged vias on the BGA site. What ar

BGA Via Tenting

Jan 21, 2005 |

BGA Via Tenting

Jan 21, 2005 | I work for a board house and our proceedure for this process is the following, We cover the via p

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