Electronics Forum: via plugging (Page 1 of 15)

via hole plugging

Electronics Forum | Wed May 19 11:50:32 EDT 1999 | Chris Nuttall

We care currently running into problems during our plug via process: At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is cau

Re: via hole plugging

Electronics Forum | Wed May 19 13:13:20 EDT 1999 | Dave F

| We care currently running into problems during our plug via process: | At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is

Re: via hole plugging

Electronics Forum | Thu May 20 07:53:55 EDT 1999 | Chris Nuttall

| | We care currently running into problems during our plug via process: | | At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.Thi

via capping

Electronics Forum | Mon Jan 11 14:48:44 EST 2010 | davef

SR1000 is commonly used for tenting. Search the fine SMTnet Archives on : tenting Someone gave us this note. We have lost their name. It seems to be good advice. If Liquid Photo Image (LPI) solder mask is required, do not tent via holes. Tenting

via in pad

Electronics Forum | Sat Oct 12 06:43:49 EDT 2002 | davef

Alternatives to consider are: * Opening-up your stencil aperture put-down more paste to compensate for the amount that is being used to fill the via. * Relaying-out the board to plug and plate over the via. * Relaying-out the board to move the via fr

conductive fill via

Electronics Forum | Mon Nov 11 11:28:32 EST 2002 | davef

Sand is not a great conductor, compared to copper. Never heard of using the stuff on RF boards. Our board fabricator uses Dupont CP100, now CP101, [or something like that cuse who's going to check?] when plugging via on cheap boards. Your board fa

via tenting and pluging

Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef

Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug

via in pad

Electronics Forum | Tue Oct 15 15:16:34 EDT 2002 | Abelardo Rodriguez Santana

We run into that issue all the time. If a corrective action must be done right away. Place Kapton tape on the bottom side of the board to cap off the via. If you have room to place tape if not use pink lady or something to plug the via. And weathe

via as test point

Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef

First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us

via as test point

Electronics Forum | Mon Feb 26 12:26:43 EST 2001 | CAM

I'm working a problem and looking for your input. Here the deal: Two sided mix technology board. Test is using unmasked via points on bottom for test points. Our fab drawing states tent via points on top side. First set of board came in with no tenti

  1 2 3 4 5 6 7 8 9 10 Next

via plugging searches for Companies, Equipment, Machines, Suppliers & Information

pressure curing ovens

World's Best Reflow Oven Customizable for Unique Applications
Void Free Reflow Soldering

Reflow Soldering 101 Training Course
Voidless Reflow Soldering

Training online, at your facility, or at one of our worldwide training centers"
PCB Handling with CE

High Throughput Reflow Oven
Hot selling SMT spare parts and professional SMT machine solutions

SMT & PCB Equipment - MPM, DEK, Heller, Europlacer and more...