Electronics Forum | Sun Dec 15 22:31:43 EST 2002 | craigj
Has anyone heard of vias cracking (barrel from pad) when being wave soldered. Was told this was a big problem by contract pcb designer, he always tent vias because of this. The reason was that the solder filling the vias caused stressing and then sep
Electronics Forum | Sat Aug 28 11:03:44 EDT 2004 | mariels
We are currently designing a multi-layer board using a BGA with a pitch of 1mm. Need to find out what hole/pad size via and if they should be plated holes? Thanks
Electronics Forum | Tue Aug 31 15:47:24 EDT 2004 | davef
Choices are: * Via Pad / Drill = 0.020 / 0.010 (Inches) * What ever the IPC land calculator says
Electronics Forum | Tue Feb 23 08:46:11 EST 2021 | dianau
Hello, I have a topic with vias discoloration(that's what supplier said) and I don't know if it's an corrosion problem or something else. I believe that maybe the PCB's are not storage properly. I must mention that aren't any problem at soldering. D
Electronics Forum | Mon Dec 16 09:36:54 EST 2002 | russ
I have never had this problem. It sounds like you are right in imagining that there must have been a bad supplier of PCBS or an inadequate design rule being followed, or a very bad wave process to have this cracking over wave solder. Some books requ
Electronics Forum | Thu Jun 03 18:51:25 EDT 2021 | emeto
It seems like some oxidation that flux is able to fix on the soldered pads. Is it looking like this before you reflow?
Electronics Forum | Mon Dec 16 10:54:48 EST 2002 | davef
Knee of barrel and pad crack: Caused by thermal stress during soldering, because epoxy expands in the "z" 3X more than "x" or "y" which are restricted by the fiber. Related to: * Design of pads too large relative to hole diameter * Temperature at o
Electronics Forum | Fri May 28 13:19:31 EDT 2021 | cbart
I can't see the image very well, but from what i see it looks like oxidation. looks like an ENIG finish on the board, possibly a plating issue from the bare board house, thin gold or the nickle is to thick. one other question i would get an answer t
Electronics Forum | Tue Dec 05 21:36:51 EST 2006 | Jimmy
Hello, Currently, we are running new product,server card, and encountered hugh false alarm (17%) at ICT station. Already confirm its is not flux issue...False call always on the vias location. I also notice the vias size is much smaller than those
Electronics Forum | Tue Aug 18 10:18:22 EDT 1998 | Dave Hulbert
I have a question on tenting of vias on PWB's. I have designed a 6 >layer, military, mixed components (all on top side), LPI soldermask >board which will be run over the wave. I was planning on tenting vias >but did not specifically specify that on f
