Electronics Forum: vias plugging (Page 1 of 14)

via hole plugging

Electronics Forum | Wed May 19 11:50:32 EDT 1999 | Chris Nuttall

We care currently running into problems during our plug via process: At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is cau

Re: via hole plugging

Electronics Forum | Wed May 19 13:13:20 EDT 1999 | Dave F

We care currently running into problems during our plug via process: At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is

Re: via hole plugging

Electronics Forum | Thu May 20 07:53:55 EDT 1999 | Chris Nuttall

We care currently running into problems during our plug via process: At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.Thi

Using LPI w/ tented vias

Electronics Forum | Fri Jun 09 17:34:08 EDT 2000 | Melanie Mulcahy

I need some information regarding the acceptability/unacceptability of using tented vias with LPI soldermask. Long story on all involved, but basically I have a board that I have had manufactured with no problems which has BGA/uBGA parts, tented via

PBGA vias throwing solder balls

Electronics Forum | Tue Sep 14 14:52:22 EDT 2004 | Carol

During processing, the solder in the vias reflows and forms solder balls. PCBs have solder in random PBGA vias from the board manufacturer.The manufacturer says this is a result of the HASL process and is unavoidable. We use HASL finish, multilayer,

PBGA vias throwing solder balls

Electronics Forum | Thu Sep 16 18:59:14 EDT 2004 | Carol

Thanks Everyone, the information was very useful. We use 7095 as a bible. A-610 6.5.3 doesn't allow for any solder balls not entrapped/attached etc. so we will look again at plugging/tenting both ends of the via. We ran into the problem of the mask

PBGA vias throwing solder balls

Electronics Forum | Tue Sep 14 19:47:16 EDT 2004 | davef

use something other than HASL. "The rest of the world seems to be processing with no problems..." [Hello!!! Earth to Carol. This is a test.] Things you are considering could be more trouble than they�re worth. "1) Reduce via hole size" [If you re

printing solder paste on test vias

Electronics Forum | Fri Aug 22 09:41:49 EDT 2003 | davef

Mantis: Kenny reflows paste on [wave solders] all via, not just the test via, to plug the via and provide for a pressure seal between the board and the test fixture. Beyond that, since solder is softer than copper [and fills the hole better], solde

BGA rework with unplugged vias PCB

Electronics Forum | Thu Dec 21 13:33:46 EST 2006 | ppcbs

The problem with super glue is that is has a cyanide base that turns into a toxic gas and evaporates when heated. See IPC-7095. Via's should be fully plugged with solder mask at the fab house. If your PCB designers are not up to speed on IPC requi

BGA rework with unplugged vias PCB

Electronics Forum | Thu Dec 07 00:55:51 EST 2006 | billylim

As you are aware the common method to rework BGA is : 1. Remove BGA with hot air reflow machine ( SRT as current practice) 2. Clean the BGA pad using solder iron and solder wick. 3. Replace BGA with SRT rework machine. The problem we have with

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