Electronics Forum | Thu Aug 24 13:36:07 EDT 2000 | Dr. Ning-Cheng Lee
Regarding the boiling point, MSDS may have some infomation reflecting that. Other description such as long stencil life and long tack time may also reflect. Wetting rate typically is not stated in product data sheet. You will need to determine it y
Electronics Forum | Wed Aug 23 08:05:50 EDT 2000 | Eugene Smelik
Dr. Lee: I have read that fillet lifting can be exacerbated by certain types of Pb-free solder. Can you explain which alloys cause this and why? Thanks! Gene Smelik Cookson Performance Solutions
Electronics Forum | Tue Aug 22 11:29:45 EDT 2000 | �ngelo Marques
Hello, Dr. Ning-Cheng Lee The melting point of solder PB-Free its to higher do you now the lower temperature of an PB-Free and its constitution. Its true if the solder paste have in its constitution a Bismut component the melting point its lower?
Electronics Forum | Tue Aug 22 09:38:02 EDT 2000 | Dante
Dr. Lee, This is a test at the request of Rick Short. Please let him know that you received this question when (and if) you receive it. Thank you Dr. Lee. Paul Ettorre Vendortech.com
Electronics Forum | Tue Aug 22 11:09:15 EDT 2000 | Eugene Smelik
Dr. Lee, Following up on this thread, I have read that a Pd-Ni lead finish is one promising option, but that Ni-oxidation might be problem. Can you explain this more? Thanks, Gene Smelik Cookson Performance Solutions
Electronics Forum | Tue Aug 22 09:30:18 EDT 2000 | gdiepstraten
With the introduction of new lead-free alloys and higher temperatures to meet their specifications, can we expect different and/or more residues in the reflow soldering process?
Electronics Forum | Tue Aug 22 08:52:39 EDT 2000 | genesmelik
Good morning Dr. Lee. I was wondering how flux chemistries have changed, or will change, with the transiton to Pb-Free, given the higher reflow temperatures required for SMT assembly?
Electronics Forum | Tue Aug 22 16:51:04 EDT 2000 | Dr. Ning-Cheng Lee
Yes, no-clean is more of a challenge, particularly for halide-free no-clean. Requirement on probe testability will make it more difficult.
Electronics Forum | Thu Jul 20 18:30:08 EDT 2000 | mbourke
What is the preferred method of cleaning misprinted double sided No-Clean boards which are assembled on side 1 ? What type of equipment is being used ? What solvents / detergents work well for a variety of solder pastes / glues ?
Electronics Forum | Fri Jul 21 14:59:58 EDT 2000 | Bob Willis
There is no easy answer to this as no one wants to do it. There are lots of systems out there but cleaning dried paste is an issue and getting paste out of holes. You should speak to the paste and adhesive supplier to check on soluability of materia
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