Electronics Forum | Wed Oct 10 13:17:27 EDT 2001 | BrianC
Universal now has Big-Board options and retrofits for GSM's. 32" kits and 25" kits. If you call them, they will come. Brian
Electronics Forum | Mon Sep 24 20:38:27 EDT 2001 | davef
Mike's comments are well taken. Your technique works fine with BGA, but uBGA are less forgiving. Again, let's take about: * Specifics of the problem. * Amount and method of applying flux. * What's holding the uBGA in-place before the solder ball an
Electronics Forum | Tue Sep 25 09:57:40 EDT 2001 | nwyatt
In regards to your last question, - problem is failures and most think it is due to too much flux - we apply flux with a brush - amount applied depends on the operator applying it - the flux is very thick and will hold the part in place before reflo
Electronics Forum | Fri Sep 28 16:51:41 EDT 2001 | pcmarch
I have had success by applying the paste flux with my finger, using a finger cot and spreading it on the PCB. This seems to put it on more consistently than using a brush.
Electronics Forum | Mon Sep 24 18:00:58 EDT 2001 | jagman
Does anyone know the cause(s) of solder flowing through a via to the other side of board during reflow causing solder bumps on opposite side? Is this mainly a design issue or could it be process related? Any help is appreciated.
Electronics Forum | Mon Sep 24 20:33:34 EDT 2001 | davef
Assuming you're seeing this during wave solder, the via acts like a heat pipe conducting 450�F [or whatever] air to your solder balls. Check the fine SMTnet Archives for similar threads and perspective on the direction to take.
Electronics Forum | Mon Sep 24 20:49:59 EDT 2001 | jagman
I'm not seeing this during the wave solder process, rather the REFLOW (convection) process. The board was design with the vias located "in" the land area.
Electronics Forum | Wed Sep 26 09:01:38 EDT 2001 | hinerman
I'm afraid I only have data that has been published previously. What I do have was created when working for other companies and can not be shared, sorry. Perhaps someone else may be able to help. Regards Jay
Electronics Forum | Wed Sep 26 11:58:13 EDT 2001 | Fox
Don't hold me to it but... Class 1-process indicator, varify value (cap, resistor) Class2,3-failure (rework required) This is what we used at my former job when i took over QA responsibility.
Electronics Forum | Wed Sep 26 12:31:02 EDT 2001 | nifhail
Let's assume that SMT or MEMS or COB etc, is a new things and about to be introduced to the line, nobody knows about this new process and I was asked to select the critical proceses and parameter, how and where should I start? Thanks and best rega
