Electronics Forum | Thu Mar 13 11:19:11 EST 2003 | gdstanton
Company B would be buying material (components and bare PWB) and fully assembling the cards for Company A.
Electronics Forum | Sun Mar 09 17:52:01 EST 2003 | davef
"Tact time" has to do with pick, move, and place. It has nothing to do with loading and unloading feeders. [Not to say a measure like that isn't good and useful, it just isn't called "tact time".]
Electronics Forum | Sun Mar 09 16:11:38 EST 2003 | Neil
I agree, with Dave what is your top 3 defects and what causes them? Most post reflow defect are already on the board before they go into the oven, all the oven does is expose them.
Electronics Forum | Mon Mar 10 15:10:49 EST 2003 | MA/NY DDave
Hi First of ALL, Thanks. I am first coming into this from the outgoing inspection or customer receiving inspection side of things.
Electronics Forum | Wed Mar 12 02:16:12 EST 2003 | Frank
Thanks, good food for thought. Trying to get prep'ed to go to APEX in a few weeks and see some AOI demos...
Electronics Forum | Mon Mar 10 02:54:22 EST 2003 | sankar
Dear All, Can you advice on how to use X-Ray system to identify the QFP/PLCC pin open application. Whether at all X-Ray can be used for the above application. If so, what will be the false rejection of the X-Ray system. Regards Sankara narayanan ME
Electronics Forum | Sat Mar 15 00:52:18 EST 2003 | Grant
Hi, We had tomb-stoning on a product, and it was quite severe. We eliminated it by reducing the amount of solder paste on the small passible component pads. We used a 5 thou stencil, with 20% reduction, and it eliminated the problem. Regards, Gra
Electronics Forum | Sun Mar 16 20:46:18 EST 2003 | MA/NY DDave
Hi Good, that is one of the things I see some have done. With paste too thick these little components float too much off, rather than centering. YiEng, MA/NY DDave
Electronics Forum | Thu Mar 20 14:01:34 EST 2003 | MA/NY DDave
Hi I understand that more circular or rounded pads also reduce the effect. I love it when many independent variables can alter the outcome. YiEng, MA/NY DDave
Electronics Forum | Thu Mar 20 14:05:17 EST 2003 | MA/NY DDave
Hi Rene Great, I am glad to see that you are recommending by experience placement control as affected by the pick operation. Neat to see you are also noting a thinner paste deposition. YiEng, MA/NY DDave
