Electronics Forum: viewed (Page 2336 of 7890)

Contamination

Electronics Forum | Wed Aug 23 10:04:24 EDT 2006 | blnorman

We have seen leakage currents around parts that have high impedance. Evidently with a small amount of moisture, weak organic acids present in the flux residue can cause a low leakage.

Stencil Cleaner

Electronics Forum | Mon Aug 14 08:00:54 EDT 2006 | davef

Systronic North America No. 5 Copper Beech Lane Ridgefield, CT 06877 Phone: 203-431-3730, 888-922-5974 (toll free) Fax: 203-431-6010 http://www.systronic.de

CMM training

Electronics Forum | Wed Aug 23 08:33:27 EDT 2006 | davef

Best we can do is: http://www.google.com/search?sourceid=navclient&ie=UTF-8&rls=GGLC,GGLC:1969-53,GGLC:en&q=training+cmm

mpm up 2000 camera problem

Electronics Forum | Tue Aug 15 02:45:14 EDT 2006 | dman97

Does anyone know if it is possible to lower the camera brightness when selecting fiducials? Our UP2020's camera is extremely bright and sometimes it causes the fiducials to be rejected cause they are too bright to be seen. Any settings than can be a

mpm up 2000 camera problem

Electronics Forum | Tue Aug 15 12:02:55 EDT 2006 | pr

Check your gel flex. They're no good. Don't use em. good Luck pr

Solder paste life cycle inside incubator

Electronics Forum | Tue Aug 15 15:48:20 EDT 2006 | Chunks

No longer than when it starts to cause defects unacceptable to company goals and/or objectives.

Vapor Pressure at lead free reflow temperatures

Electronics Forum | Tue Aug 15 19:07:13 EDT 2006 | vlad_uk

With the added temperature peak associated to Lead free reflow is anyone seeing or concerned about the increased vapor pressure that may result from moisture entrapment in moisture sensitive components?

Solder Ball After Reflow Process

Electronics Forum | Wed Aug 16 14:30:31 EDT 2006 | slthomas

What do you mean by "near the pad of SMT component"? The end of the pad, side of the pad, or perhaps adjacent to the part body, between terminations? One solder ball per component, or many, perhaps of different sizes?

Solder Ball After Reflow Process

Electronics Forum | Fri Aug 18 09:07:22 EDT 2006 | russ

pretty much menaing Amol, that the balls are stuck to the board by flux and when you wash the flux the balls go away with it. If yopu are running no clean, then there will be no cleaning step and the balls will remain since the flux is basically unt

Solder Ball After Reflow Process

Electronics Forum | Fri Aug 18 09:28:24 EDT 2006 | russ

okay, very admirable, so you will need to answer the rest of the questions that were posed. Such as the actual profile, storage and handling, registration of paste, etc.... I would lean towards Chunks thoughts myself as well. Russ


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