Electronics Forum | Tue Jun 17 11:02:47 EDT 2008 | dwelch123
You need to adjust the air kiss. The machine blows a slight amount of air after placement and it is probably adjusted too high.
Electronics Forum | Tue Jun 17 15:00:36 EDT 2008 | duchoang
"The machine blows a slight amount of air after placement and it is probably adjusted too high. " Is that adjustable and how to do it on TopazX2 Assembleon Pick and Place Machine?. Thank you very much.
Electronics Forum | Wed Jun 18 07:48:29 EDT 2008 | gemengr
vo^ cai' tab pick vacuum% set at 30 and tab mount vacuum % set at 30 . neu^' va^n~ con` bi. thi` set lai vacuum cho nozzle #72 in machine data. by the way duyHoang o*? ddau^ zi?? good luck
Electronics Forum | Wed Jun 18 08:07:58 EDT 2008 | davef
Here is a link to a basic discussion of solder mask application methods: http://www.ami.ac.uk/courses/topics/0221_smp/index.html
Electronics Forum | Wed Jun 18 11:53:58 EDT 2008 | edbedie
I need to buy a good copy of the book Electronic Packaging: Design, Materials, Process, and Reliability. Does anyone have one they would sell?
Electronics Forum | Wed Jun 18 12:17:17 EDT 2008 | mainenetservices
Our good friends at the SMTA have a bookstore, see: http://smta.org/store/book_detail.cfm?BOOK_ID=50 Be sure to let 'em know we sent ya ;) Roland
Electronics Forum | Wed Jun 18 15:44:39 EDT 2008 | ampearl
I believe it is short for Oscilloscopes which is used to debug signals. How that relates to SMT I don't know...I am only a recruiter.
Electronics Forum | Wed Jun 18 15:53:08 EDT 2008 | Paul M.
Oh. You mean "Oscope", which is short for oscilloscope. I'd apply, but I'm stuck here in beautiful Colorado. Good luck with your recruiting !!
Electronics Forum | Fri Jun 20 13:53:59 EDT 2008 | ck_the_flip
I googled this and this is what comes up: http://en.wikipedia.org/wiki/Othello I guess Othello was a Shakespeare tragedy.
Electronics Forum | Wed Jun 18 18:24:07 EDT 2008 | jensteele
Does anyone know of an established guideline for thickness requirements? Our smaller pads continue to receive a thicker solder deposition when we measure by the larger pads for process accessibility and vice versa for the larger pads when we measure
