Electronics Forum | Wed Jun 12 10:53:15 EDT 2002 | genny
350 candlepower is fairly low for high detail work. I spent some time in the construction industry laying out electrical blueprints for schools, and such. It was desirable to have more in the order of 700 fc for the desk surface that kids would wor
Electronics Forum | Tue Jun 11 10:59:08 EDT 2002 | jseagle
Thanks Dave. My engineers are not going to like the news but it's good for me. Maybe now they will use 0603s instead of the 0402s which are not required due to plenty of board space being available. They want to do 0402s just because we now have a
Electronics Forum | Tue Jun 11 12:08:43 EDT 2002 | davef
It's like Mom used to say, "Just because you CAN hit something hard with the thing that you use to think, that doesn't mean you SHOULD do it." [Er, words to that effect.] If your engineers feel a need to develop 0402 process, maybe they should cons
Electronics Forum | Fri Jun 07 17:27:50 EDT 2002 | nuezmaster
I am having some diffuculty convincing our exec. staff that by increasing our personel on the floor, we will actually improve our machine efficiency. We currently have seven lines, four of them have two P&P machines in line. At this point there is
Electronics Forum | Wed Jun 19 18:41:52 EDT 2002 | nuezmaster
Our plan right now is only to increase production on the products that we are behind on. Since we are currently running three shifts with seven assembly lines and only adding six people (3-Days, 3-Nights), it averages out to about a 20% increase ove
Electronics Forum | Thu Jun 20 04:49:34 EDT 2002 | scottxiao
according to the ressult of cross-section and removing the component, I find there is no black area in the left pad, and the IMC is also normal, so the black nickle is less impossible. the PCB material is not common FR4, just some thing like ceramic,
Electronics Forum | Wed Jun 12 03:26:03 EDT 2002 | edahi
We are currently having gross tombstoning with 0402 capacitors. We are using HiPb Solder Paste mounted on Laminate substrates. We are assembling Flip Chip BGA's. Temp @ Reflow is around 230-240 C to meet the thermal requirements for both die bump
Electronics Forum | Wed Jun 12 10:42:06 EDT 2002 | stepheno
Check your land patterns. I believe someone once made a typo on specs for land pattern spacing and the specs are still being used by some people. I worked for a CM that had a customer that spaced the pads for 0402's too far apart. It was the only
Electronics Forum | Wed Jun 12 18:04:47 EDT 2002 | stownsend
Is this a new problem on an old product, or is this a first run? If this is a new problem on an old product, you may want to check the paste process. If the paste is not even across both pads or is offset a bit, the parts will pop up. If this is a f
Electronics Forum | Wed Jun 12 11:49:32 EDT 2002 | jax
The machines you choose depends on the boards you build and how many of them you build. Assembleon is designed for faster production speeds where Juki is more flexible. Why are you just looking at these two? Aren't they in different leagues? Why not
