Electronics Forum | Wed Aug 04 23:12:37 EDT 2004 | dougt
To get you started: You would begin with a comparitor, one input would be referenced to a voltage that you want the output to "trip" at. The second input would be where you apply your "voltage" that you are using to start the motor. The output of
Electronics Forum | Tue Aug 03 03:27:35 EDT 2004 | kent_peterson
You have alot of advantages staying with the Samsung. The CP60 is a great machine. With the removable carts for setting up in advance giving quick change over. Very good price and better service for you than we get here. Their parts teach on these is
Electronics Forum | Thu Aug 05 13:46:56 EDT 2004 | mdm4ua
I don't know what the availability is in your area but You might want to look into Mydata. The machines are not as fast as some but very versatile and have faster changover than any of the machines that I have seen. PS. I work for a contract manuf
Electronics Forum | Fri Jul 30 03:33:07 EDT 2004 | tuner73
Is anyone out there reworking the AMP BGA ziff sockets? AMP's recommendation is that it cannot be reworked. I have successfully reworked the 604 ball version of this socket, but I am having problems with the 603 ball version. I am using an Air-Vac
Electronics Forum | Fri Jul 30 11:32:31 EDT 2004 | westred
I am looking for a fool-proof way to have operators measure PCB's out of the depaneler to ensure that the tolerances for the outside edges are being met. Probably a spot check system to make sure the process is in tolerance. So far building a "GO"
Electronics Forum | Mon Aug 02 13:46:10 EDT 2004 | Bob R.
Via in pad lets your layout guy run traces on inner layers so there's more more area available on the outer layers for placing parts, test point, etc. There are also electrical advantages due to shortening paths, but I'm just a simple mechanical eng
Electronics Forum | Fri Jul 30 16:28:27 EDT 2004 | crios
I was just told by a visitor (PCB Experts) at our company that RFID PCBs should not be built using a no clean solder flux process due to possible reliability issues. This really got my boss going and asked me to look into this. This is the first time
Electronics Forum | Sat Jul 31 08:52:15 EDT 2004 | g2garyg2
I am soldering with a softbeam laser and often get a flux/solder build up at the end of the feed tube. Seems better when we use Senju wire but this is very costly. It seems like we have tried everything to resolve this. Would appreciate assistance on
Electronics Forum | Wed Aug 04 10:19:51 EDT 2004 | davef
Consider: * Reducing the size of the pads * Reducing the amount of solder paste * Inspecting the print. A print with irregular form (eg, print finishes with a tail, the print is inclined or something like that) * Too long in the reflow zone * Bad ali
Electronics Forum | Thu Aug 05 04:51:37 EDT 2004 | Bryan
The ball pitch is 1.10mm and the pad diameter is 0.45mm,so we designed the aperture diameter as 0.45 on 0.13mm thick stencil.Bridging rate decreased a great deal,but the balls still deformed in the same area.and found it no use reducing the reflow ti
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