Electronics Forum | Wed Apr 13 05:48:52 EDT 2005 | charly
hi' i need advise on immersion silver PCb shelf life. 1) what is the shelf life for Immersion silver PCB? 2) iF PCB expire, can we bake the immersion PCB? what temp & duration? 3) How long can we keep the pCB again after rebaking? (with vacuum seal)
Electronics Forum | Tue Apr 19 11:54:36 EDT 2005 | masters
The email address was stripped from this post, a user complained about receiving a virus or some malicious code from the suspected address. Knowingly sending viral code is against the law. Posting personal information to circumvent SMTNet is again
Electronics Forum | Wed Apr 20 08:06:21 EDT 2005 | davef
We'd reject the boards because: * Vacuum seal is punctured. * HIC is expired. One of the nice things about immersion coatings is that the fab can rework the coating. You cannot do that with other coatings. Finally, every HIC that we investigated c
Electronics Forum | Wed Apr 13 15:21:25 EDT 2005 | mmjm_1099
Thats called technician syndrome (fine when your there and bad when you walk away). Is someone inspecting the board before reflow? If so make sure they don't touch it and run about 5 boards and see if it's consistent for placement. What type of pro
Electronics Forum | Thu Apr 14 13:53:39 EDT 2005 | jdengler
The board warp is a good place to look. Also: -Are you pre-rotating? -Are you using the largest nozzle possible? Most of the time this ends up being a component slip on the nozzle caused when the part is rotated if not doing pre-rotate, or slippa
Electronics Forum | Fri Apr 15 11:16:03 EDT 2005 | HOSS
It's a longshot but.....I have seen low-standoff parts move caused by via's under the part erupting from within internal layers (outgassing). If this is a multilayer PCB and vias are not well plated or pourus, they can and will expand when heated.
Electronics Forum | Mon Apr 18 09:52:36 EDT 2005 | pjc
FormFlex and the GridLok system will not work on a semi-automatic printer. They were designed for fully automatic machines. The print table is very shallow on the DEK 248, SMTechs and MPM SPM, UP100 and MicroFlex. DEK should have magnetic base suppor
Electronics Forum | Wed Apr 13 18:28:21 EDT 2005 | RT
We have a situation where our customer returned a device (BGA) with a missing solder ball. The process is Copper-Nickel-Gold-Solderball. EDX revealed that no trace of gold nor solder material (lead-free balls). Could poor Au plating/adhesion cause
Electronics Forum | Thu Apr 14 05:23:10 EDT 2005 | dj_jago
What is the pitch of the device and what type of flux are you using? You may eridicate the fault by using a more active flux. I assume you are flowsoldering the device as opposed to paste in hole. Do you have an air knife? If so, you could tr
Electronics Forum | Thu Apr 14 18:51:19 EDT 2005 | KEN
What side is the short occuring on. Topside or bottom (solder) side? 2. Pitch of hole pattern = ? 3. Your x-ray may not have the resolution or DSP capable of detecting this defect. How does your profile look? Is this a true short or the result
