Electronics Forum | Tue Mar 22 11:57:07 EDT 2011 | jercole
Make sure the paper is advancing correctly on > your stencil wiper. I have seen this cause major > issues. If the paper hangs up, it will smear > paste across the bottom of the stencil every time > it wipes. We are manually cleaning the stenci
Electronics Forum | Fri Apr 08 15:27:05 EDT 2011 | stimpk
A couple more things to look at. ( DEK) Check you wiper blades. This is the rubber blade that holds the paper in contact with your stencil. When these wear down it will not clean properly. Also make sure when you run this product that you verify that
Electronics Forum | Wed Mar 23 05:17:23 EDT 2011 | arwankhoiruddin
Hi All. I want to know what is the IPC/JEDEC standard for solder paste printing defects. From the brochures of SPI Machines, the recognized defects are excessive, insufficient, misalignment, no solder, bridging, and solder shape error. What document
Electronics Forum | Wed Mar 23 11:08:36 EDT 2011 | davef
There is no such standard, nor should there be. The important thing is to make good solder connections. That's IPC standardization focus, defining good results of manufacturing process. The approach that you take in developing the process of making g
Electronics Forum | Wed Mar 23 10:15:10 EDT 2011 | bwjm
I am thinkingof purchasing a juke 740. The seller told me that the machine is capable of mounting down to 0402 and 0.5mm ic pitch, but I search the net I realize that it is able to mount 01005 and ic pitch 0.3mm. So is my machine seller's information
Electronics Forum | Wed Mar 23 11:48:11 EDT 2011 | charliedci
bwjm, We have placed 0402's with 740 and it worked well. When new (if 1005's existed then) maybe, but that sounds like a seller/manufacurer quoting specs. I would think all 740's being used are well used, so placement accuracy might not be per mac
Electronics Forum | Wed Mar 23 13:19:40 EDT 2011 | bwjm
Charlie, thanks for the reply. But I am still unclear with the machine capabilities. Does the standard ke740 able to place 01005 components or is it the machine was upgraded to place 01005? This is my first time getting a placement machine, I am quit
Electronics Forum | Wed Mar 23 22:29:21 EDT 2011 | nkinar
I have a few prototype circuit boards with BGA footprints where some (but not all) of the vias have been placed too close to the pads. During reflow, some of the solder from the balls flowed into the holes. Only one of the pads under the BGA is not
Electronics Forum | Thu Mar 24 16:06:34 EDT 2011 | nkinar
Thanks for the reply, davef. Due to prototyping time constraints, I've been asked by the engineers if I could do something on the SMT line to salvage this prototype PCB. Could I do anything to connect the pad or fill the via? Much of the board h
Electronics Forum | Fri Mar 25 17:11:04 EDT 2011 | ARS
Hopefully someone can share information about x-ray inspection for mid - complex boards. Currently we have installed a couple of 5Dx Stations at our facility at the back end and we want to evaluate moving those stations into outr SMT lines ( off line
