Electronics Forum | Wed Feb 03 15:29:33 EST 2016 | sarason
Have you ever done QC type thinking on your problem or are you aware o fthe methodology? Do you run your plant in a clean room environment? Do you clean after reflow? If not Why? What sort of products are you running? What sort of oven are we ta
Electronics Forum | Fri Feb 05 09:13:13 EST 2016 | emeto
Hello Greg, there are several things to be considered: I will start this investigation in the oven. Look in your cooling zones. Many ovens build up a lot of flux there(especially the ones with water cooling) and should be cleaned every so often.
Electronics Forum | Thu Mar 17 12:49:12 EDT 2016 | mnorthey
Thanks every one. I fixed the problem. It was the VM1540A I/O board. Now run back to normal Glad to hear you got it going, I have a Fuji repair manual if you would like to have it. I also have some old circuit cards I don't need anymore. Let me
Electronics Forum | Fri Feb 05 11:03:46 EST 2016 | xroot1
Hi, We purchased an MDC7722FV from MDC (same machine that Adafruit talks about it their blog: http://www.ladyada.net/wiki/mdcpickandplace ) We would like to know if anyone still has such a machine or maybe has used a similar machine in the past so
Electronics Forum | Mon Feb 08 08:33:30 EST 2016 | claudea2
Hello, Our EKRA E4 goes off-line after this error message: Application error: SCB16 caused a General Protection Fault in module SBCDRV.EXE at 0011:10DD. Any ideas on how to troubleshoot this? It is running Windows for workgroup 3.11
Electronics Forum | Tue Feb 09 17:11:14 EST 2016 | vaghelarajeshh
I have pad lift issue during the rework on Motorola box DSR600 which has the fault of No log and No boot. Pad lifting pattern is on four corners. I have checked the temeprature difference between the corners which is sam as center. I have attache
Electronics Forum | Thu Feb 16 05:49:28 EST 2017 | endruw18
Hello everyone.Ihave an Intel 855pm Northbridge and when i removed the chip,i lifted 4 pads one of them is VSS so i dont care it but the 3 other is:HI 4 ,HI8 and HI 6 (hub interface for cmos i/o or simply hub interface ).Are the vital or only testing
Electronics Forum | Mon Feb 20 08:33:57 EST 2017 | philc
In your pictures, many of the pads that have lifted from the PCB look as though they have no conenctions anyway. We often find that pads that aren't connected lift very easily. One possible solution would be to bake the BGA's for 12 hours prior to f
Electronics Forum | Wed Feb 10 14:19:30 EST 2016 | davef
Here's what I know about CE marking: * It applies to equipment producers that market their product to be used by Eurolanders. * CE is not an end-user requirement. * Eurolanders define the equipment requirements. * Equipment producers self-certify com
Electronics Forum | Fri Feb 19 05:14:04 EST 2016 | truewanderer
Hi, i have a confusion to read the dimension of BGA package from the datasheet. I have attached the datasheet below. Is this diameter of the ball 0.30mm or 0.15mm. I'm confused about the values given in the box. Whats meant by M, S, A and B. Please g
