Electronics Forum | Fri Jul 24 03:23:34 EDT 2020 | xinyao
So I got this fully auto running machine line, that automatically pick, cut, edge grind, corner round the copper clad laminate, and I do not have a professional camara to shoot a video. How can shoot it with my phone, and still it looks amazing? Than
Electronics Forum | Wed Jul 29 18:51:29 EDT 2020 | davef
You're asking about unclad FR4 [G10 is not flame retardant] Just ask for 0/0 unclad FR4. Thicknesses: 0.010", 0.020", 0.031", 0.047", 0.059" 0.090" & 0.118" "What do you folks do when you need custom formers?" Call Butler Winding [I receive no benef
Electronics Forum | Mon Aug 10 12:58:04 EDT 2020 | SMTA-64386637
We have found Acrylic CC under QFNs is a failure mechanism in thermal cycling. The coating acts as a wedge and causes solder joint cracks. We do not coat QFNs. To enhance reliability we have the vias plugged with solder mask. This eliminates some
Electronics Forum | Thu Aug 20 07:11:25 EDT 2020 | sssamw
What your said looks like a acrylic coating thermal expansion causes small solder joint crack. Do you cure coating with heating, or heating after curing? Solder joint crack while you see resistor and QFN trouble? Clear and detail description of your
Electronics Forum | Tue Aug 04 14:29:14 EDT 2020 | dwl
Is the component an LGA or BGA? If its a BGA, it appears like the component is missing balls, if its an LGA, it appears like the solder isn't wetting to the component. What solder are you using? The wetting to the larger pads in the last pic seems
Electronics Forum | Fri Aug 07 03:16:33 EDT 2020 | rsatmech
It's a BGA component. Missing ball is not possible because we have enabled the vision in pick and place. Solder paste is OM353 type 5 Possibilities of Flux dry before reflow seems valid but I saw the board data it was completed on time like other
Electronics Forum | Fri Aug 07 20:07:16 EDT 2020 | emeto
Based on datasheet you can have balls with significant variation(twice volume) 0.13Sqr/0.19sqr = 0.46 I would suggest you tighten the machine recognition control. You will recognize BGA balls that are very different in size and reject the part. This
Electronics Forum | Wed Aug 05 08:57:23 EDT 2020 | oxygensmd
Snap off is an option to make distance between PCB and stencil. If the distance not enought, adjust the PCB thickness too. Mostly we don't use snap off, I more prefer if the stencil is tight with the PCB - I know, this make the stencil lifetime worst
Electronics Forum | Thu Aug 06 05:29:25 EDT 2020 | bangir
Hi Chris, Thank you for your advise. We got problem on key in parameters. Why we can't save value on parameter after key in manually? When we key in Parameter, we used password 9060. Is there any other password to key in and save machine parameter? T
Electronics Forum | Wed Aug 05 14:53:08 EDT 2020 | dwl
I don't know about potted PCBs, you'd have to talk to the recycle. My guess is it doesn't matter, worse case they just pay you a little less per weight so you'd just keep the potted PCBs separate from the rest of the waste.
