Electronics Forum | Wed Jul 12 13:06:41 EDT 2000 | Brian W.
I have done both. If you have a line that runs both sides in none pass, running the adhesive side first allows you to have one less machine or station for board flipping. If you have to move the board from one line to another, or back to the front
Electronics Forum | Fri Jul 07 09:15:23 EDT 2000 | K. Chak
Hi Dave, This particular p/n calls for print&etch for wet process..and the problem occured due to surface contamin. with resist residue resisting copper from etching off. The high pressure nozzle was a problem at developing oper. and it is fixed now
Electronics Forum | Sat Jul 01 04:22:09 EDT 2000 | Sal
I have two questions 1. How do I control the skewing of FETs/power regulators ? ( the one's with the big rectangular pad and two smaller one's for the leads).If I go 1:1 with the apertures I seem to get solder balling and when I tryed to minimise th
Electronics Forum | Thu Jul 06 07:40:51 EDT 2000 | Christopher Lampron
SAL, How large is the pad in relation to the solderable area on the component. I have seen similar instances where the heat sink of the component covered almost the entire bottom of the part. If your pad is the same size and the aperture is 1:1, ther
Electronics Forum | Fri Jun 30 15:12:55 EDT 2000 | John Thorup
Hi Walter It might be a stupid question but have you tried cal comp? This is a current model and they shouldn't have any trouble supporting it. www.GTCOcalcomp.com Did you buy it with the Mydata? Most of their options have to be activated with a "se
Electronics Forum | Fri Jun 30 10:42:24 EDT 2000 | Chrys Shea
That pad had a 16 mil dia, so I arrived at 20 mil squares by adding 2 mils to each side of the pad. Following that logic, a 12 mil pad would use a 16 mil square. But a 12 mil pad is on a finer pitch that isn't mentioned, so you should definitely
Electronics Forum | Thu Jun 29 08:47:34 EDT 2000 | JAX
Mark, The machine you decide to go with will probably depend on what you have already. If you use an offline optimizer, you will want a machine that will work with the software(Fuji, Universal, whatever you use!). If you plan on programming online,
Electronics Forum | Thu Jun 29 12:36:10 EDT 2000 | Gary
You might try your search with the words Adhesive Dispenser. We recently evaluated machines from Asymtek, a Nordon company, Camalot, and Zmation, and GPD. There are several others. One consideration in the scenario you described is to make sure th
Electronics Forum | Thu Jun 29 10:11:06 EDT 2000 | John Thorup
Hi Bob, welcome Let's take this a little further. You'll also see HASL referred to as HAL and gold referred to as ENIG (electroless nickle, immersion gold. Other common surface finishes for preserving solderability include OSP(organic suface protect
Electronics Forum | Fri Jun 30 13:45:20 EDT 2000 | Paul Wright
Ioan, It looks like the JEDEC Standard is a place to start. I think it would be possible to have people follow the standard internally. Getting the external customers to follow will be difficult at best. But if its possible to develop a close rela
