Electronics Forum: viewed (Page 5206 of 7890)

IC plastic encapsulant family

Electronics Forum | Mon Jun 05 14:08:41 EDT 2000 | Bob Smith

I am trying to find the plastic family used in manufacturing the bodies of integrated circuits. Usually our product is fully encapsulated in ScotchCast however a new application requires part of a pressure sensor chip to be free of encapsulant. The S

Re: IC plastic encapsulant family

Electronics Forum | Wed Jun 07 20:21:26 EDT 2000 | Dave F

Point well taken John. Expanding on epoxies: Novolac is a multifunctional epoxy ... a phenolic resin. Most phenolic resins are made using phenol (P) and formaldehyde (F). They comprise the bulk of IC packaging and are divided into two classes:

Re: IC plastic encapsulant family

Electronics Forum | Wed Jun 07 21:07:07 EDT 2000 | Dave F

Ooooops, I messed that up!!!! It should read: Point well taken John. Expanding on epoxies: Novolac is a multifunctional epoxy ... a phenolic resin. Most phenolic resins are made using phenol (P) and formaldehyde (F). They comprise the bulk of

Re: Delmat mechanical properties

Electronics Forum | Fri Jun 02 17:43:17 EDT 2000 | Dave F

James: I believe Delmat is a proprietary product. Check with some of the solder fixture fabricators in the archives. Continuing, I would not select knowingly Delmat as a board stiffener. It's a composite material similar to oriented strand board

Component Counter - THT!!

Electronics Forum | Thu Jun 01 17:29:27 EDT 2000 | C.K.

Okay, so my boss gives me this little "side project" that nobody else wanted to do... ....our Component Prep area (an area that no Engineer wants to support) is in need of a thru-hole component counter - counts both bulked and reeled parts. They ha

Re: Solder Mask problem

Electronics Forum | Thu Jun 01 21:54:00 EDT 2000 | Dave F

Jeremy: Standards: � A-600 talks about percentage of solder mask loss allowed, according to the location (eg, laminate, bare copper, gold or nickel, melting metals) and equipment class. � A-610 talks to "Solder Resist Coating - Voids & Blisters" by

Black hole process (MacDermitt) for PCB fab

Electronics Forum | Tue May 30 09:27:08 EDT 2000 | PhilB

More and more PCB fabs are switching from chemical copper to what is called a "black hole" process from McDermitt.In this process a very thin layer of carbon is put on the base material instead of chemical copper. Can anyone tell me about the advanta

unable to send internal mail

Electronics Forum | Tue May 30 08:14:34 EDT 2000 | Aerin Bryson

I had a problem accessing my mail for along time, however, that is resolved now. Now I am having trouble sending email - I sent a test message to an internal smtnet recipient and one to an external recipient and both went OK. Other than that I have

Re: unable to send internal mail

Electronics Forum | Tue May 30 09:53:43 EDT 2000 | Neil Peaslee

Right now we are using a custom built web email solution to provide SMTnet web email. Unfortunately the service agreement recently expired and I have to keep a fairly close eye on it to make sure that it is running. Within the next few weeks we will

need for an old design and BOM

Electronics Forum | Tue May 30 08:07:56 EDT 2000 | David Lazarus

I am a senior industrial engineering student at the University of South Florida. For my Facility Design class, my team has chosen to design a PCA plant that will make one product. We are looking for an obsolete or in-service circuit board assembly


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