Electronics Forum | Thu May 10 13:58:26 EDT 2001 | tomgervascio
It sounds like 3D imaging is much better at fault detection for partially visible leads like SOJ packages. Can any of the 2D systems actually do a solderjoint inspection on the outer rows of BGAs or is the angle too acute to accurately look at these.
Electronics Forum | Tue May 08 08:41:29 EDT 2001 | caldon
Hmmmmm........I am thinking!!!!! Cleaning is the final process in our situation. After cleaning we have no need for the fiducials. Is the haze causing fiducial recognition problems? Ideally what you are looking for is a contrast between fiducial and
Electronics Forum | Tue May 08 12:57:30 EDT 2001 | Morris
I've seen these used & they work quite well. The fiberglass scratch brush. http://contacteast.com/product/prodpage.cfm?grp=4F7A9B48-C870-11D4-8A700050DA5FEB55&sid=FC52FB8C-A662-46E4-B3CBDAD625F7B085 You will want to train the operators to use some
Electronics Forum | Tue May 08 08:26:15 EDT 2001 | caldon
Yes Siemens has a fixed tray feeder for matrix trays. If I remember correctly the tray will occupy 1/2 of the table.The feeder is a two part system 1) is the base 2) the the flat tray (just like what is used in the waffle pack changer). the flat tray
Electronics Forum | Mon May 14 13:01:21 EDT 2001 | Charlie
We had two 51 space trays. One was modified by machine shop to hold two waffle trays. We bought a 31 space tray thinking it would hold one tray, it doesn't. We modified it to hold one tray. We than learned, from tech support, that a 31 space base sho
Electronics Forum | Mon May 28 04:29:16 EDT 2001 | hello
we met the same problem with audit, and i make a tooling log for each stencil and in tooling log , set up some criteria for checking such as tension , mechanical damage, printing result ect. The stencil will be checked periodicly by process engineer,
Electronics Forum | Wed May 09 01:40:55 EDT 2001 | Dreamy
Hi Michael, DPMO Index calculation - The total number of defects (Dc + Dp + Dt) on a completed Printed Circuit Board divided by the total number of defect opportunities (Oc + Op + Ot) for that PBA multiplied by 1 million. Your calculation deals only
Electronics Forum | Tue May 08 21:13:04 EDT 2001 | Paul
My company is a low-volume high mix contact electronic manufacturer. We are currently looking at purchasing a pick and place machine that is capable of mounting such new components as microBGA's and other CSP's at such ball pitches as 0.5mm for examp
Electronics Forum | Fri Aug 24 14:56:11 EDT 2001 | Hussman
Paul, All the machines yulisted are very god at placement. One thing to keep in mind is parts availability. Some of our jobs come from the customer in "kits". Not everyone supplies you with a full real of parts. Be sure that the machine you pick
Electronics Forum | Tue Aug 28 09:53:44 EDT 2001 | Brock
Stefan, I could be wrong but I have a question about every 10th board having a defect. If a machine places 1 million components and a the board has 200 components you arrive at 5000 boards. If every 10th board has a defect, then only 500 boards have
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