Electronics Forum | Tue Dec 29 03:37:09 EST 1998 | John W
| can some kind of through hole type connector pass through | the smt process (with IR technology)???? | the temperature factor or material factor????? | There's a company called Samtec (web site is www.samtec.com) who can provide these.They have a
Electronics Forum | Tue Dec 29 17:29:46 EST 1998 | Dave F
| can some kind of through hole type connector pass through | the smt process (with IR technology)???? | the temperature factor or material factor????? | Flag: Most PTH components are not spec'd for reflow processes. PTH component suppliers, nomin
Electronics Forum | Mon Dec 28 14:57:07 EST 1998 | Earl Moon
| Looking for additional handling and baking information of moisture sensitive IC'c beyond/or inadditotn to IPC - SM - 786 A. Publications, guidelines, baking experience. | Much depends on your environmental controls and those of your suppliers. PB
Electronics Forum | Mon Dec 28 10:36:25 EST 1998 | Brian Conner
We are looking into a SRS machine, and one question keeps coming up, "If we pull out all the solder, will the recycling company refuse to purchase the remaining dross?" Anyone who out there that uses a SRS machine(Solder Recovery System) I would app
Electronics Forum | Mon Dec 28 10:17:09 EST 1998 | Earl Moon
| Does anyone have any experience with vibration testing of BGA packages and assemblies? We are starting to design BGA's into some of our products and we have not found very much information on vibrational test results. Any information will be help
Electronics Forum | Mon Dec 28 11:21:21 EST 1998 | Brad Kendall
| Does anyone have any experience with vibration testing of BGA packages and assemblies? We are starting to design BGA's into some of our products and we have not found very much information on vibrational test results. Any information will be help
Electronics Forum | Sat Dec 26 12:17:02 EST 1998 | Dave F
| Any one know a good stencil vendor who can produce stencils below .002" foil with appetures at .004" on .008" pitch? AMTX use to be my vendor but they are closed down. | | Thanks, | | Chris Grendler | Chris: One source of e-formed stencils r
Electronics Forum | Mon Dec 28 12:16:40 EST 1998 | Jon Medernach
Chris, We are involved in several developments using gold stud bump attach. We make a stud bump bonder and have several processes for attach. Solder attach is best done by plating up the substrate, the underfill must be able to provide enough mechan
Electronics Forum | Tue Dec 29 10:24:35 EST 1998 | Earl Moon
| Chris, We are involved in several developments using gold stud bump attach. We make a stud bump bonder and have several processes for attach. Solder attach is best done by plating up the substrate, the underfill must be able to provide enough mech
Electronics Forum | Wed Dec 23 21:27:26 EST 1998 | Jim Mitchell
Many machines now have adaptive pick that helps tune in the pickup as the 0402 part moves around in the pocket. Fuji may have a feature like this, but I think they adapt the pickup in only one axis (by adjusting the feeder rack). Unfortunately this
