Electronics Forum | Mon Sep 14 13:17:03 EDT 1998 | Alan Archer
Try contacting Count on Tools in Gainesville GA. They are also an after-market manufacturer of nozzles including Fuji. The gentleman to speak to is Mr. Curt Couch. 800-538-0426. Good Luck. Regards, Alan Archer | Has anyone used Fuji's rubber tip n
Electronics Forum | Tue Sep 15 07:46:01 EDT 1998 | Wayne Bracy
| Another inexpensive, but good nozzle resource is WP Sales | (817) 459-0181 | I believe they can also do Custom nozzle jobs. | -Ben | Wayne....Should Hover Davis be mentioned here too? Ben: Would you get your ACT together. Just joking. Sure we sh
Electronics Forum | Mon Sep 14 10:25:40 EDT 1998 | Wayne Bracy
| Our company currently donesn't have any type of sonic wash to wash boards that have been "miss printed" Wanting to know the best way to go about this. So what we are having to do is spray down the boards with alcohol and wipeing the solder paste
Electronics Forum | Fri Sep 11 14:15:24 EDT 1998 | tim scully
Thanks to all Earl, Mathew and David for the SMT info. I have one more question. Does anybody have a chart listing the standard, industrial spacings? Perhaps listing in each unit, say XX mils = XX Pitch. Or XX mils = XXmm or something of that nat
Electronics Forum | Thu Sep 10 22:33:24 EDT 1998 | S. Evers
| At the current time we are scoring and then | depanelizing by hand. Can anybody provide | info on other techniques for separating parts | from the panel? Thanks in advance. | Scott C. Something new that got its start in Japan is now being used fo
Electronics Forum | Thu Sep 10 16:15:52 EDT 1998 | Larry Johnson
I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the B
Electronics Forum | Sat Sep 12 20:28:29 EDT 1998 | Rick Bell
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Thu Sep 10 11:57:20 EDT 1998 | James Michaud
I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress reli
Electronics Forum | Fri Sep 11 00:52:19 EDT 1998 | Rick Thompson
| I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress re
Electronics Forum | Thu Sep 10 10:07:46 EDT 1998 | J.H Kim
I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE mismatches, no leads for stress relief,
