Electronics Forum: viewed (Page 5386 of 7890)

Re: Philips FCM

Electronics Forum | Tue Aug 04 16:30:36 EDT 1998 | Jim Price

| I am considering of Philips FCM for the next production. | But I have heard a rumour saying this machine is not capable for checking the lead polarity due to the laser scan system. | i.e. SOT might be populated in wrong direction. | Can somebody ad

How long for NPI?

Electronics Forum | Tue Jul 21 17:06:55 EDT 1998 | Jerry

I have some general questions about new product introduction: 1. How much capacity on the average is committed (line shifts) are committed by your factory to NPI? ie. We commit one line on 8 hour shift per day to NPI. 2. How many NPI's would you com

Re: BGA rework station and x-ray inspector

Electronics Forum | Sat Aug 15 07:56:16 EDT 1998 | Clyde F.

| | We need BGA rework station and x-ray inspector recently in urget case, Do you have any information to rework FPGA package and inspect them during processing. | Thx for any information | Best Regards, | Stoney Tsai PACE just came out with a new s

Re: BGA rework station and x-ray inspector

Electronics Forum | Wed Jul 22 13:57:03 EDT 1998 | bill

| | We need BGA rework station and x-ray inspector recently in urget case, Do you have any information to rework FPGA package and inspect them during processing. | Thx for any information | Best Regards, | Stoney Tsai If you are doing any reballing

Re: BGA rework station and x-ray inspector

Electronics Forum | Tue Jul 21 06:47:14 EDT 1998 | wayne

| | We need BGA rework station and x-ray inspector recently in urget case, Do you have any information to rework FPGA package and inspect them during processing. | Thx for any information | Best Regards, | Stoney Tsai Stoney: Take a look at the Aust

Re: Lead-Free Solder Paste

Electronics Forum | Tue Jul 21 09:53:13 EDT 1998 | Steve Brown

Here at M/A-Com we use lead free solder pastes for two purposes, environment and prevention of secondary reflow in subsequent processes. The UK engineering journals all report the trends towards lead free alloys, especially in the telecommunications

Re: SMT, lead form and trim equipment

Electronics Forum | Mon Jul 20 13:28:14 EDT 1998 | Chris Fontaine

We regularly form QFP's and FP's (pitches to 20 mil) and have experience with both Knight and Fancort equipment, however most of our experience has been with Knight. Knight Tool has been consistently good, and I've had some sour experiences with Fan

My advice is DON'T

Electronics Forum | Mon Jul 20 12:58:51 EDT 1998 | Dew Lolly

QFP's are best left the professionals. There are MANY subtle issues with fine pitch lead forming such as critical tool design issues ability to check critical dimensions etc. Unless you want to replow this grown in hopes of getting a promotion or c

Re: Reliability of coated Plastic encapsulated Microcircuits

Electronics Forum | Wed Jul 22 16:00:24 EDT 1998 | David A. Pinsky

| Who knows something about the reliability of plasti PEMS and its enhancemant by application of conformal coating (Parylene, metal, SiO2, SiNxOx, etc.) ? We have performed failure analyses on PEM's in our lab for many years. The vast majority of pa

Re: Stencil opening for 0603,0402 ?

Electronics Forum | Mon Jul 20 13:47:04 EDT 1998 | MMurphy

:On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their own you


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