Electronics Forum | Wed Oct 23 15:33:38 EDT 2002 | Randy V.
Dye penetrant is a liguid that will wick through very small cracks. I used over 10 years ago for checking cracks in glass feedthru's in hermetic packages. You put the dye on one side of the seal and developer (white) on the other side and the red dye
Electronics Forum | Mon Oct 28 08:54:57 EST 2002 | Chris Lampron
Good Morning, I think that the use of No clean at SMT and the use of WS at wave is counter productive. For the most part, you will get better results using WS at SMT. If you use No Clean, and then are forced to run this thought a water wash as a req
Electronics Forum | Wed Oct 30 09:43:01 EST 2002 | gregp
Larger tighter spaced balls will present a problem in sealing the vacuum cup. There will be more leakage in this case. It really depends upon the application. The BGA you mention should not be a major concern. The bigger problems are with bigger
Electronics Forum | Fri Jun 18 11:31:17 EDT 2004 | gregp
I think it depends on the thickness of the PORON sheet. For .3mm balls you could probably get away with a pretty thin sheet (maybe 1/16"). I don't know how thin it comes offhand. For the part you are describing I woulf try maybe a 3.5mm OD and a 1
Electronics Forum | Fri Oct 25 03:46:37 EDT 2002 | Adam
GUYS HOW SAFE IS IT TO USE RMA FLUX WHICH IS DESIGNED FOR WAVE SOLDERING, TO USE FOR TOUCH-UP/REWORK ? CURRENTLY ALL OUR OPERATORS HAVE LITTLE RE-FILLABLE BOTTLES AND GO AND FILL THEM UP FROM THE FLUX CONTAINERS ( I'M NOT EVEN TOO SURE WHETHER OR NO
Electronics Forum | Fri Oct 25 14:46:50 EDT 2002 | russ
Leading edge, This is used to determine the orientation of the board as you want to run it. If you use center justified stencils this is usually not an issue since you can just turn the stencil any which way you want to. If you are using front/rear
Electronics Forum | Tue Oct 29 15:55:16 EST 2002 | babe
If you are using a low end hot air system IE: Weller, Hakko or Pace then your problems are with the system and not necessarily with your process. However process is important. We have found by inspection with an Ersa Scope (BGA inspection system) tha
Electronics Forum | Wed Oct 30 12:32:10 EST 2002 | dragonslayr
Have you tried doing a reflow of the BGA with the connectors removed? This should solve the question of connector proximity giving you a problem. Also, try rotating the board 90 deg in your rework station before reflowing a BGA. Be sure to rotate th
Electronics Forum | Tue Oct 29 15:25:12 EST 2002 | russ
Thanks for the info, I have previously not used the Ps and Qs so to speak and I am finding now that we are running into trouble mostly due to component height and body sizes. So for example we currently have "16 pin SOP" what we need is "16 pin SOP,
Electronics Forum | Wed Oct 30 02:53:43 EST 2002 | Frank
The market is ripe with used equipment out there. So a small CM, such as us, are looking to find a good deal out there. I am concerned about being able to get service support from a PnP manufacturer if we buy equipment on the used market. Particul
