Electronics Forum | Wed Feb 11 09:07:37 EST 2004 | Ashok Thiyagarajan
HI I am currently having a wafer which is stud bumped (Au), I am printing conductive adhesives (with silver fillers) on the pads , and by thermocompression bonding, I am establishing the connnection between. But right now the problem is the silver
Electronics Forum | Thu Feb 12 13:50:06 EST 2004 | cyber_wolf
Just a thought: I think that we could motivate our US manufacturing force to unprecedented levels of throughput, efficiency, and quality if it was acceptable to motivate employees with bamboo canes. On a serious note; how can we (U.S.), ever be comp
Electronics Forum | Thu Feb 19 19:34:52 EST 2004 | Tom B.
Jim, There are 2 thoughts to this technology. SMDP (Soldermask Defined Pads) Can achieve more uniform opening of the land, yet as you know Regisration shift of mask can become a problem. Also there has been debate as to whther SMDP cause crack p
Electronics Forum | Wed Feb 11 18:21:39 EST 2004 | Steve
Does anybody know if there is such a thing as individual component paste stencils, and who would sell such an item? The reason I am asking is because we have instances when we build prototypes that we don't need a full stencil. We may only need to pl
Electronics Forum | Wed Feb 18 12:42:43 EST 2004 | babe
OK, if the sphere of the ball and the paste on the pad are both eutectic, 63/37 then the paste will reflow first causing a drop of the component, after which the spheres will reflow causing a double drop and a good intermettalic. You can see this by
Electronics Forum | Thu Feb 12 10:31:43 EST 2004 | Glen Roberts
I have been actioned with introducing a new fault data collection system within our Business. We are a high mix, low volume, pca contract electronic manufacturer. Currently our manual inspection stations fill out hard copies of QUAD sheets listing a
Electronics Forum | Sun Feb 22 15:53:13 EST 2004 | Dreamsniper
Hi, Try using or creating a simple data collection system using MS Access...Try this idea: operator inspects the board, then scans the PCB barcode. Then enters the fault found using the codes you are using in your sheet. It's a bit laborious but it
Electronics Forum | Wed Apr 14 10:58:12 EDT 2004 | heatherc
Aegis software offers an MES system that offers both automated and manual data collection points. All of the data collected is automatically deposited in one central database. This database is then used for generating all of the SPC reports for ana
Electronics Forum | Sat Feb 14 12:25:37 EST 2004 | I ramos
I populate several thin panels (0.032")using a > Samsung S-2000 P-N-P machine. With panel sizes > of 8" by 10", it is very difficult to clamp the > panels into the machine with deflection and > bowing. Also, the Samsung makes it very difficult
Electronics Forum | Mon Mar 01 21:52:56 EST 2004 | Ken
Asking the Grid Lok to flatten out the board is like asking the SMT Reflow Furnace to detab the panel. It was not designed to make up for the deficiencies of your fab supplier or your unsuported 1st reflow pass on the the chain conveyor. However, i
