Electronics Forum | Tue Nov 10 12:23:38 EST 2009 | CL
Good Morning, I agree. This has been a problem job for us. They are looking for anything that could be implicated. Right now, they are focusing on the profile. My question pertains to the frequency of micro voiding on BGA devices. I have seen some
Electronics Forum | Mon Nov 16 10:50:50 EST 2009 | ppcbs
I agree customer is being overly stringent, and that their is a possibility that BGA's have voids prior to installation. If you determine that the BGA's do not have voids prior to installation I suggest you slow down your ramp speed to allow the flu
Electronics Forum | Mon Nov 09 18:54:27 EST 2009 | aqueous
The AQ400 Series (manufactured between 1992 and 1996 used a Myron-L brand resistivity controller. If you purchased this machine from Aqueous Technologies you would have received a Myron-L manual which describes the calibration procedure in detail.
Electronics Forum | Thu Nov 12 04:35:13 EST 2009 | sachu_70
You can certainly venture out to the nearest lab for in-depth analyses. But since you mention 2-3% defectives in a batch, there is much you can do in-house as well. Measure the height of your solder paste deposit (in zero print gap condition)across a
Electronics Forum | Thu Nov 12 09:32:30 EST 2009 | spitkis2
Take a look at http://www.atco-us.com/products/info/3 . Benchtop version is also available. A full forced convection oven delivers much better thermal uniformity than an IR/forced air combo system. When comparing different ovens, some things to
Electronics Forum | Fri Nov 13 11:41:37 EST 2009 | gregcr
Hi All, I am implementing a proper feeder maintenance program for my HSP chipshooter feeders. I have the calibration jig. I am developing a procedure with the following general steps: 1. Cleaning 2. Visual Inspection / Repair 3. Calibration / Testi
Electronics Forum | Fri Nov 13 18:29:50 EST 2009 | luisreyes
really need help!! Our company is experiencing a change on the Quality system. one of the things that we are discovering is the amazing variation during the reflow oven and wave solder processes. this week we found that the team had not been performi
Electronics Forum | Tue Nov 17 22:36:17 EST 2009 | rajeshwara
Hi All Plz help , we are manufacturer of Set Top Boxes , where we use ST BGA 5202 ,Paste : ALPHA METAL OM338-T45-LF & STENCIL : 4 MIL & we also tried 5 mil . Problem : At first Test BGA work fine but after some days Assembly dead functional and when
Electronics Forum | Thu Nov 19 02:22:12 EST 2009 | andrzej
Hi, we have an idea of running one side of PCB using 58Bi/42Sn solder to prevent glueing components on other side of PCB when board is on second run through SMT process. I wonder what issues we can meet once we try to use SAC305 when reworking some
Electronics Forum | Tue Nov 24 10:03:45 EST 2009 | andrzej
Actully none couse we glue them. Please see attached file - there are red dots marking glue placment. I understand you want to check if there is any sense in gluing components. I`ll ask one more time - Is anoyne who reworked SMDs with SAC305 where
