Electronics Forum: viewed (Page 6266 of 7889)

Battery Nickel strips soldering in HASL PCB finish

Electronics Forum | Fri Nov 23 05:59:18 EST 2018 | premkumar_haribabu

Hi RObl, Thanks for response , sorry to ask again & again . Is cobar paste solved the issues from poor wetting from nickel to PCB soldering,whether it will improve the peel off strenth more than 5 kg ?? as per our current last production , this nic

dek 265 LT screen printer unable to detect the plate

Electronics Forum | Tue Nov 20 00:15:41 EST 2018 | sabeti

Hi Everybody, We have a dek 265 LT screen printer which unable to detect the plate. I think that it might be the light barrier sensor with the part number of 13pl14. I cannot find a new sensor so I thought I can use a jumper to connect the black wir

Trying to solder on the solder destination to fill PTHs. Does any IPC standard have requirements for this?

Electronics Forum | Thu Nov 22 23:46:27 EST 2018 | jaypark

Some PTHs on a board in the product I am building are not filled enough to meet the IPC-610-F requirement(at least 75% vertical fill) . I have no access to the solder source side due to something installed right beneath it. In order to completely

Trying to solder on the solder destination to fill PTHs. Does any IPC standard have requirements for this?

Electronics Forum | Fri Nov 30 12:21:26 EST 2018 | davef

Three things ... 1. Since you are soldering a component over a hole that limits the possibility that the hole could be filled with solder, it makes me wonder if the hole is supposed to be filled with solder. What do the engineering notes say? 2. Ta

ePM-SPI software help needed

Electronics Forum | Mon Nov 26 11:41:34 EST 2018 | tey422

Anybody is familiar with ePM-SPI software? All the ones who trained are left the company, and there is no notes nor manual left behind which I can look up to learn it. Are there manual available for sharing or useful training material for the ePM-S

Axial VCD Sequecer 5 Clinch Issue (NEED HELP)

Electronics Forum | Wed Nov 28 21:37:53 EST 2018 | lukejk95

Hello, so basically I've been having trouble with parts popping up as they are being inserted into the PCB. It happens at random and I've gone through multiple rebuilds and tons of adjustments and still cant get a clean run. I've tried raising the cu

Axial VCD Sequecer 5 Clinch Issue (NEED HELP)

Electronics Forum | Thu Nov 29 12:28:32 EST 2018 | slthomas

What I'm thinking is that your cutter/former (or whatever the "boot" shaped assembly is called, that provides the dies for cutting and forming parts from the tape) could be worn, dull, bent, etc., and once in a while you get a lead that doesn't enter

Component ( Connector ) drop during secondary reflow

Electronics Forum | Tue Dec 04 02:32:38 EST 2018 | ameenullakhan

Hi, Thanks for the valuable feedback. Agree with you. 1. We have similar component on both the side of the board. 2. The component fall was random like 4 out of 100 components.But last build it has increased. 3. Applying glue dot is option , bu

Can someone take a measurement on a HELLER oven please

Electronics Forum | Mon Dec 03 08:25:29 EST 2018 | proceng1

I have a Heller 1808 Reflow oven with the chain that has the edge hold to keep the boards off of the mesh belt. The feed end was more narrow than the exit end, and some boards would fall off. So we adjusted both ends to be the same. Well now, when

Can someone take a measurement on a HELLER oven please

Electronics Forum | Mon Dec 03 14:49:23 EST 2018 | dleeper

Are they getting stuck inside the oven or at the very end? If thermal expansion is the problem the boards would be getting stuck in the reflow zone since that would be the hottest and therefore the point where thermal expansion would be the greatest


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