Electronics Forum | Thu Feb 08 13:23:32 EST 2007 | smtstaff
SMTnet is looking for your input on a problem that has started to become serious... You may have noticed that the forum has had some spam posted... in the past serveral weeks in fact several hundred have been posted. We are soliciting your views a
Electronics Forum | Thu Feb 22 20:34:25 EST 2007 | davef
This [ http://www.smtnet.com/library/index.cfm?fuseaction=view_article_html&file=no_hasl ] describes HASL [hot air solder leveling], as well as other common types of solderability protection. It goes on the discuss the impact of the use of these coa
Electronics Forum | Tue May 08 09:15:12 EDT 2007 | kenpeh
Hi It is very interest topic on building a AOI internal.(10000) I am very aggree on Machine designer point of view. I had gone throught the state of develop a post reflow AOI which complete it begining of this year. Just share part of it. Few poi
Electronics Forum | Mon Apr 30 00:49:07 EDT 2007 | Ron Rumrill
Let me chime-in regarding impact pressure. By definition, impact pressure is determined by several factors: 1. The weight of the water (a constant) 2. Its velocity (determined by the GPM and nozzle�s orifice size) 3. The area impinged (determined
Electronics Forum | Thu May 17 21:50:29 EDT 2007 | jeremyl
Hi All. We are a tiny startup company developing an IC in a flip-chip CSP package. We find ourselves in need of being able to remove and replace (ie rework) our chip on a characterization board. The board will not be big and the chip is very small
Electronics Forum | Mon Oct 08 15:41:33 EDT 2007 | bbarton
Worked for MPM for many years, and this sounds like a fairly common problem which is easy to fix if you can answer a few questions, several of them already asked... 1. Is this happening only on this board (if the answer is yes, this is a good thing!
Electronics Forum | Tue Nov 20 17:07:20 EST 2007 | kennyrebbe
I am looking for a new semi automatic Stencil printer, and reflow oven that is capable of doing double sided boards with BGA�s. We currently own a Manncorp 4500R stencil printer https://www.manncorp.com/4x00_stencil_printers/index.php?view=overview&a
Electronics Forum | Wed Jun 18 13:08:52 EDT 2008 | sleech
Dave: You are spot-on right! The major hurdle is that 70 degrees C is below the boiling temperature of water. Only a near zero relative hudity chamber will cause the ingested moisture to migrate from a package. There is one facet of the 70 degree p
Electronics Forum | Tue Jan 29 12:40:07 EST 2008 | somprakash
With the objective of providing highly learning experience with cost-effective RFID courses at your desktop, RFID4U � A World wide leader in RFID learning solutions offers spectrum of RFID e-Learning courses which split into separate series like Comp
Electronics Forum | Thu Jul 17 20:46:55 EDT 2008 | davef
Which type? * Solder beads (mid-chip solder balls, attached to the waste line of your chip caps and resistors) This is more paste volume related. * Solder balls that tend to be more randomly scattered (as in spattered)? This tends to be more profile
